arXiv · 0706.0866
Coherent spin transport through a 350-micron-thick Silicon wafer
Abstract
We use all-electrical methods to inject, transport, and detect spin-polarized electrons vertically through a 350-micron-thick undoped single-crystal silicon wafer. Spin precession measurements in a perpendicular magnetic field at different accelerating electric fields reveal high spin coherence with at least 13pi precession angles. The magnetic-field spacing of precession extrema are used to determine the injector-to-detector electron transit time. These transit time values are associated with output magnetocurrent changes (from in-plane spin-valve measurements), which are proportional to final spin polarization. Fitting the results to a simple exponential spin-decay model yields a conduction electron spin lifetime (T1) lower bound in silicon of over 500ns at 60K.
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Biqin Huang, Douwe J. Monsma, Ian Appelbaum. 2007-09-14. Coherent spin transport through a 350-micron-thick Silicon wafer. https://doi.org/10.1103/physrevlett.99.177209
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