A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

H. Chen; L. Hsu; X. Wei

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arXiv · 0801.0997

A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices

H. Chen·L. Hsu·X. Wei

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Abstract

This paper describes a novel integrated circuit technology to manufacture high-density thermoelectric devices on a semiconductor wafer. With no moving parts, a thermoelectric cooler operates quietly, allows cooling below ambient temperature, and may be used for temperature control or heating if the direction of current flow is reversed. By using a monolithic process to increase the number of thermoelectric couples, the proposed solid-state cooling technology can be combined with traditional air cooling, liquid cooling, and phase-change cooling to yield greater heat flux and provide better cooling capability.

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H. Chen, L. Hsu, X. Wei. 2008-01-07. A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices. https://arxiv.org/abs/0801.0997

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