arXiv · 1102.1297
Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers
Abstract
In this work we studied Ag surfactant induced growth of Cu/Co multilayers. The Cu/Co multilayers were deposited using Ag surfactant by ion beam sputtering technique. It was found that Ag surfactant balances the asymmetry between the surface free energy of Cu and Co. As a result, the Co-on-Cu and Cu-on-Co interfaces become sharp and symmetric and thereby improve the thermal stability of the multilayer. On the basis of obtained results, a mechanism leading to symmetric and stable interfaces in Cu/Co multilayers is discussed.
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S. M. Amir, Mukul Gupta, Ajay Gupta, J. Stahn, A. Wildes. 2011-02-07. Surfactant induced smooth and symmetric interfaces in Cu/Co multilayers. https://doi.org/10.1088/0953-8984%2F23%2F48%2F485003
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