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arXiv · 1109.6268

A combination of capillary assembly and dielectrophoresis for wafer scale integration of carbon nanotubes-based electrical and mechanical devices

Florent Seichepine·Sven Salomon·Maéva Collet·Samuel Guillon·Liviu Nicu·Guilhem Larrieu·Emmanuel Flahaut·Christophe Vieu
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Abstract

The wafer scale integration of carbon nanotubes (CNT) remains a challenge for electronic and electromechanical applications. We propose a novel CNT integration process relying on the combination of controlled capillary assembly and buried electrode dielectrophoresis (DEP). This process enables to monitor the precise spatial localization of a high density of CNTs and their alignment in a pre-defined direction. Large arrays of independent and low resistivity (4.4 x 10^-5 Ω.m) interconnections were achieved using this hybrid assembly with double-walled carbon nanotubes (DWNT). Finally, arrays of suspended individual CNT carpets have been realized and we demonstrate their potential use as functional nano-electromechanical systems (NEMS) by monitoring their resonance frequencies (ranging between 1.7 MHz to 10.5MHz) using a Fabry-Perot interferometer.

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Florent Seichepine, Sven Salomon, Maéva Collet, Samuel Guillon, Liviu Nicu, Guilhem Larrieu, Emmanuel Flahaut, Christophe Vieu. 2011-09-28. A combination of capillary assembly and dielectrophoresis for wafer scale integration of carbon nanotubes-based electrical and mechanical devices. https://arxiv.org/abs/1109.6268

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