Airtight metallic sealing at room temperature under small mechanical pressure

Stephen P. Stagon; Hanchen Huang

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arXiv · 1308.0359

Airtight metallic sealing at room temperature under small mechanical pressure

Stephen P. Stagon·Hanchen Huang

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Abstract

Here, we report a process of metallic sealing using small well-separated Ag nanorods; the process is at room temperature under a small mechanical pressure of 9.0 MPa, and also in ambient. The metallic seals have an air leak rate of 1.1 x 10-3 cm3atm/m2/day, and mechanical shear strength higher than 8.9 MPa. This leak rate meets the requirement of organic solar cells and organic light emitting diodes [1].

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Stephen P. Stagon, Hanchen Huang. 2013-08-01. Airtight metallic sealing at room temperature under small mechanical pressure. https://arxiv.org/abs/1308.0359

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