arXiv · 1710.03678
Single shot ultrafast laser processing of high-aspect ratio nanochannels using elliptical Bessel beams
Abstract
Ultrafast lasers have revolutionized material processing, opening a wealth of new applications in many areas of science. A recent technology that allows the cleaving of transparent materials via non-ablative processes is based on focusing and translating a high-intensity laser beam within a material to induce a well-defined internal stress plane. This then enables material separation without debris generation. Here, we use a non-diffracting beam engineered to have a transverse elliptical spatial profile to generate high aspect ratio elliptical channels in glass of dimension 350 nm x 710 nm, and subsequent cleaved surface uniformity at the sub-micron level.
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R. Meyer, M. Jacquot, R. Giust, J. Safioui, L. Rapp, L. Furfaro, P. -A. Lacourt, J. M. Dudley, F. Courvoisier. 2017-09-29. Single shot ultrafast laser processing of high-aspect ratio nanochannels using elliptical Bessel beams. https://doi.org/10.1364/ol.42.004307
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