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arXiv · 1807.09472

Millimeter-Wave Propagation within a Computer Chip Package

X. Timoneda·S. Abadal·A. Cabellos-Aparicio·D. Manessis·J. Zhou·A. Franques·J. Torrellas·E. Alarcón
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Abstract

Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM).

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X. Timoneda, S. Abadal, A. Cabellos-Aparicio, D. Manessis, J. Zhou, A. Franques, J. Torrellas, E. Alarcón. 2018-07-25. Millimeter-Wave Propagation within a Computer Chip Package. https://doi.org/10.1109/iscas.2018.8351875

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