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arXiv · 2008.04182

Scaling of Multi-contact Phase Change Device for Toggle Logic Operations

Raihan Sayeed Khan·Nadim H. Kanan·Jake Scoggin·Helena Silva·Ali Gokirmak
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Abstract

Scaling of two dimensional six-contact phase change devices that can perform toggle logic operations is analyzed through 2D electrothermal simulations with dynamic materials modeling, integrated with CMOS access circuitry. Toggle configurations are achieved through a combination of isolation of some contacts from others using amorphous regions and coupling between different regions via thermal crosstalk. Use of thermal crosstalk as a coupling mechanism in a multi-contact device in the memory layer allows implementation of analog routing and digital logic operations at a significantly lower transistor count, with the added benefit of non-volatility. Simulation results show approximately linear improvement in peak current and voltage requirements with thickness scaling.

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Raihan Sayeed Khan, Nadim H. Kanan, Jake Scoggin, Helena Silva, Ali Gokirmak. 2020-08-10. Scaling of Multi-contact Phase Change Device for Toggle Logic Operations. https://arxiv.org/abs/2008.04182

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