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arXiv · 2206.08184

Terahertz Oscillator Chips Backside-coupled to Unclad Microphotonics

Daniel Headland·Yosuke Nishida·Xiongbin Yu·Masayuki Fujita·Tadao Nagatsuma
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Abstract

Terahertz technology is largely dependent upon planar on-chip antennas that radiate downwards through the substrate, and so an effective means to interface these antennas with integrated waveguides is an attractive prospect. We present a viable methodology for backside coupling between a terahertz oscillator chip and a broadband all-intrinsic-silicon dielectric waveguide. Our investigation employs resonant tunneling diodes as compact two-terminal electronic terahertz oscillators, and terahertz waves are observed from 270 GHz to 409 GHz. The fact that this power is accessed via a curved length of silicon waveguide validates successful backside coupling.

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Daniel Headland, Yosuke Nishida, Xiongbin Yu, Masayuki Fujita, Tadao Nagatsuma. 2022-06-16. Terahertz Oscillator Chips Backside-coupled to Unclad Microphotonics. https://arxiv.org/abs/2206.08184

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