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arXiv · 2304.08629

Identification and Mitigation of Conducting Package Losses for Quantum Superconducting Devices

Yizhou Huang·Yi-Hsiang Huang·Haozhi Wang·Zach Steffen·Jonathan Cripe·F. C. Wellstood·B. S. Palmer
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Abstract

Low-loss superconducting rf devices are required when used for quantum computation. Here, we present a series of measurements and simulations showing that conducting losses in the packaging of our superconducting resonator devices affect the maximum achievable internal quality factors (Qi) for a series of thin-film Al quarter-wave resonators with fundamental resonant frequencies varying between 4.9 and 5.8 GHz. By utilizing resonators with different widths and gaps, different volumes of the stored electromagnetic energy were sampled thus affecting Qi. When the backside of the sapphire substrate of the resonator device is adhered to a Cu package with a conducting silver glue, a monotonic decrease in the maximum achievable Qi is found as the electromagnetic sampling volume is increased. This is a result of induced currents in large surface resistance regions and dissipation underneath the substrate. By placing a hole underneath the substrate and using superconducting material for the package, we decrease the ohmic losses and increase the maximum Qi for the larger size resonators.

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Yizhou Huang, Yi-Hsiang Huang, Haozhi Wang, Zach Steffen, Jonathan Cripe, F. C. Wellstood, B. S. Palmer. 2023-04-17. Identification and Mitigation of Conducting Package Losses for Quantum Superconducting Devices. https://doi.org/10.1063/5.0155053

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