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arXiv · 2312.15807

The influence of thermo-electromechanical coupling on the performance of lead-free BNT-type piezoelectric materials

Abstract

In recent times, there have been notable advancements in haptic technology, particularly in screens found on mobile phones, laptops, LED screens, and control panels. However, it is essential to note that the progress in high-temperature haptic applications is still in the developmental phase. Due to its complex phase and domain structures, lead-free piezoelectric materials such as BNT-based haptic technology behave differently at high temperatures than ambient conditions. Therefore, it is essential to investigate the aspects of thermal management and thermal stability, as temperature plays a vital role in the phase and domain transition of BNT material. A two-dimensional thermo-electromechanical model has been proposed in this study to analyze the thermal stability of BNT material by analyzing the impact of temperature on effective electromechanical properties and mechanical and electric field parameters. However, the thermo-electromechanical modelling of BNT ceramics examines the macroscopic effects of the applied thermal field on mechanical and electric field parameters as phase change and microdomain dynamics are not considered in this model. This study analyzes the impact of thermo-electromechanical coupling on the performance of BNT-type piezoelectric materials compared to conventional electromechanical coupling. The results predicted a significant improvement in piezoelectric response compared to electromechanical coupling due to increased thermoelectric effect in absence of phase change and microdomain switching for temperature boundary conditions below depolarization temperature ($T_{d}$~200$^{\circ}$C for pure BNT material).

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BibTeXRIS

Akshayveer, Federico C Buroni, Roderick Melnik, Luis Rodriguez-Tembleque, Andres Saez, Sundeep Singh. 2023-12-25. The influence of thermo-electromechanical coupling on the performance of lead-free BNT-type piezoelectric materials. https://arxiv.org/abs/2312.15807

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