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arXiv · 2401.08335

Metal-Polypyridyl Complexes in Electronic Circuits

Rajwinder Kaur·Bijai Singh·Vikram Singh·Prakash Chandra Mondal
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Abstract

The integration of functional molecules onto conductive or dielectric surfaces represents a promising avenue for employing molecule-centric technologies, encompassing sensor development, electrochromic, and the facilitation of charge and spin transport at the nanoscale These assemblies exhibit robust physical and chemical stability, exerting influence not only on the interfacial properties of pertinent surfaces but also on the characteristics of the assembled molecules themselves. Within the spectrum of available molecules, metal-polypyridyl complexes have emerged as focal points of investigation for generating surface-bound assemblies, encompassing monolayers or multilayers, achieved through pre- or post-functionalization methodologies. The appeal of these complexes lies in their inherent versatility, stemming from facile synthesis, appreciable stability, and tunable properties encompassing redox behaviors, reactivity in excited states, luminescent emissions, excited state longevity, as well as responsiveness to stimuli-induced electron and energy transfer. This comprehensive review aims to delve into the nuanced traits and applications of surface-bound metal-polypyridyl complexes, elucidating their characteristics and practical implementations through pertinent and illustrative examples in the field of molecular electronics.

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Rajwinder Kaur, Bijai Singh, Vikram Singh, Prakash Chandra Mondal. 2024-01-16. Metal-Polypyridyl Complexes in Electronic Circuits. https://arxiv.org/abs/2401.08335

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