Evaluation of Thermal Performance of a Wick-free Vapor Chamber in Power Electronics Cooling

Abstract

Efficient thermal management in high-power electronics cooling can be achieved using phase-change heat transfer devices, such as vapor chambers. Traditional vapor chambers use wicks to transport condensate for efficient thermal exchange and to prevent "dry-out" of the evaporator. However, wicks in vapor chambers present significant design challenges arising out of large pressure drops across the wicking material, which slows down condensate transport rates and increases the chances for dry-out. Thicker wicks add to overall thermal resistance, while deterring the development of thinner devices by limiting the total thickness of the vapor chamber. Wickless vapor chambers eliminate the use of metal wicks entirely, by incorporating complementary wettability-patterned flat plates on both the evaporator and the condenser side. Such surface modifications enhance fluid transport on the evaporator side, while allowing the chambers to be virtually as thin as imaginable, thereby permitting design of thermally efficient thin electronic cooling devices. While wick-free vapor chambers have been studied and efficient design strategies have been suggested, we delve into real-life applications of wick-free vapor chambers in forced air cooling of high-power electronics. An experimental setup is developed wherein two Si-based MOSFETs of TO-247-3 packaging having high conduction resistance, are connected in parallel and switched at 100 kHz, to emulate high frequency power electronics operations. A rectangular copper wick-free vapor chamber spreads heat laterally over a surface 13 times larger than the heating area. This chamber is cooled externally by a fan that circulates air at room temperature. The present experimental setup extends our previous work on wick-free vapor chambers, while demonstrating the effectiveness of low-cost air cooling in vapor-chamber enhanced high-power electronics applications.