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arXiv · 2404.19263

mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems

Nima Baniasadi·Rami Hijab·Ali Niknejad
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Abstract

This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology.

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Nima Baniasadi, Rami Hijab, Ali Niknejad. 2024-04-30. mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems. https://arxiv.org/abs/2404.19263

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