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arXiv · 2606.22149

Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration

Himanandhan Reddy Kottur·Nusra Akter Takia·Mahamudul Hassan Fuad·Istiaq Firoz Shiam·Matthew Walsh·Navid Asadizanjani
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Abstract

Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To examine how practitioners view this transition, an anonymous survey was distributed across a broad set of organizations involved in semiconductor design, packaging, systems, tools, & failure analysis. The survey collected approximately one hundred responses & probed organizational background, supported product domains, future priorities in failure analysis, critical bottlenecks, sample preparation challenges, emerging architecture specific pain points, & perceived needs for workflow acceleration & data standardization. The results show that heterogeneous integration, chiplet, and three-dimensional products dominate the respondent base at 69%, while package & heterogeneous integration failure analysis received the highest importance rating at 7.92 out of 10. Hybrid bonding emerged as the most difficult new architecture to analyze at 54%, higher-resolution non-destructive imaging ranked as the most important future accelerator at 8.18 out of 10, and 83% of respondents supported formalized data standardization frameworks. The complete survey data are provided in Appendix A (Table II) to improve transparency & support future benchmarking.

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Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad, Istiaq Firoz Shiam, Matthew Walsh, Navid Asadizanjani. 2026-06-20. Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration. https://arxiv.org/abs/2606.22149

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