Non-reciprocal heat transfer advances flexible thermoelectric devices

Abstract

Complex heat dissipation assemblies, inferior performance, and limited flexibility are the primary constraints impeding the wide application and commercialization of conventional flexible thermoelectric devices in wearable electronics and other high-end cooling scenarios. In this work, we report a non-conventional design for flexible thermoelectric devices which can reduce the temperature to -7.03 at room temperature without external heat sink, achieving a cooling temperature drop of 29.25. The design is based on non-reciprocal heat transfer, integrated with thermally conductive composites and screen-printing technologies. This approach takes advantage of directional heat flow, thereby eliminating the need for complex heat sink networks, which extend the applications of flexible thermoelectric devices from personal thermal management to more broader fields such as home healthcare and emergency first aid.