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A possible solution of the grain boundary problem for applications of high-Tc superconductors

G. Hammerl·A. Herrnberger·A. Schmehl·A. Weber·K. Wiedenmann·C. W. Schneider·J. Mannhart
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Abstract

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a threefold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4x10^6 A/cm2 can be achieved for an average grain alignment of 10 degree at 77K. Based on this approach, a road to competitive high-Tc cables is proposed.

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G. Hammerl, A. Herrnberger, A. Schmehl, A. Weber, K. Wiedenmann, C. W. Schneider, J. Mannhart. 2002-08-13. A possible solution of the grain boundary problem for applications of high-Tc superconductors. https://doi.org/10.1063/1.1516831

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