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Andrea Picco

Publications and source records attributed to Andrea Picco.

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The KNN rollercoaster: from bulk ceramics to phase engineered wafer-scale thin films

Since the initial disclosure of the extraordinary piezoelectric coefficients of Potassium sodium niobate (KNN) in near-equimolar bulk ceramics, its development trajectory has resembled a rollercoaster, with its integration into microelectronics severely lagging due to thermodynamic stability issues and poor planar process compatibility. In this work, we revisit the bulk-derived phase diagram for the specific case of thin films integrated on silicon. By systematically investigating Mn-doped K1-xNaxNbO3 films grown on 8-inch wafers, we demonstrate that the optimal stoichiometry for thin films fundamentally diverges from the bulk equimolar standard. A Na-rich composition (> 70 at.%) is required to overcome substrate-induced constraints, effectively suppressing pyrochlore formation and chemical phase segregation while promoting dense columnar growth with a complete (001) out-of-plane polar orientation. Consequently, Na-rich films deliver outstanding functional properties, reaching remanent polarizations up to 14 uC cm-2, with piezoelectric coefficients of d33f= 79 pm/V and e31f = 10 C/m2. Supported by Density Functional Theory simulations, we correlate this enhancement with improved stability and a strain-driven structural reorientation toward a lower-symmetry monoclinic phase with tilted polarization. By redefining the phase engineering rules for wafer-scale thin films, our results establish a clear route toward KNN integration in microsystems.

cond-mat.mtrl-sci

Wafer-Scale Integration of Piezo- and Ferroelectric Al0.64Sc0.36N Thin Films by Reactive Sputtering

Large-area deposition of Aluminium-Scandium-Nitride (Al1-xScxN) thin films with higher Sc content (x) remains challenging due to issues such as abnormal orientation growth, stress control, and the undesired crystal phase. These anomalies across the wafer hinder the development of high scandium-content AlScN films, which are critical for microelectromechanical systems applications. In this study, we report the sputter deposition of Al0.64Sc0.36N thin films from a 300 mm Al0.64Sc0.36 alloy target on 200 mm Si(100) wafers, achieving an exceptionally high deposition rate of 8.7 {\mu}m/h with less than 1% AOGs and controllable stress tuning. Comprehensive microstructural and electrical characterizations confirm the superior growth of high-quality Al0.64Sc0.36N films with exceptional wafer-average piezoelectric coefficients (d33,f =15.62 pm/V and e31,f = -2.9 C/m2) owing to low point defects density and grain mosaicity. This was accomplished through the implementation of an optimized seed layer and a refined electrode integration strategy, along with optimal process conditions. The wafer yield and device failure rates are analysed and correlated with the average stress of the films and their stress profiles along the diameter. The resulting films show excellent uniformity in structural, compositional, and piezoelectric properties across the entire 200 mm wafer, underscoring their strong potential for next-generation MEMS applications.

cond-mat.mtrl-sci