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Archishman Gupta

Publications and source records attributed to Archishman Gupta.

2 recordsLinked to original sources

Ab Initio strain-dependent vibrational analysis of different silicene structures for 2D devices

We report first-principles phonon dynamics studies in isotropically strained mono-layer silicene films of various topologies by density functional theory and density functional perturbation theory methods. The strain introduced in the sheets are of both tensile and compressive nature and its effect on the thermal transport properties are analysed using the Boltzmann Transport Equation (BTE) reported. We performed electronic and vibrational analysis of each silicene topology and concluded that hhk-silicene is a potential candidate for next generation electro-thermal devices due its molecular stability, bulk-Si like bandgap and tolerable thermal performance that can be engineered by strain. The novel hhk-silicene topology offers excellent thermal and electronic capabilities that are sensitive to strain along with the band gap following a near-linear monotonically decreasing trend making it suitable for strain-tronics applications.

cond-mat.mtrl-sci↗

Ab Initio studies on strain-dependant thermal transport properties of Graphene

In this work, we present a comprehensive investigation of graphene's thermal conductivity using first-principles density functional perturbation theory calculations, with a focus on the phonon and lattice vibrational properties underlying its superior heat transport capabilities. The study highlights the role of phonon frequencies, lifetimes and mode-resolved contributions in determining graphene's thermal performance, emphasizing its high phonon group velocities and long mean free paths that contribute to thermal conductivity exceeding 3000 W/mK at room temperature. The results are compared with other two-dimensional materials like silicene (10 W/mK) and MoS2 (83 W/mK), to underline graphene's advantages in nanoscale applications. Here we report the concept of "velocity-lifetime trade-off" and use it to explain graphene's excellent invariance to high tensile and compressive strains as it exhibits minimal variation in thermal conductivity, making it an ideal material for applications requiring stability in environments with strain variability and deformation. This study establishes graphene as a benchmark material for thermal transport in next-generation 2D channel FET devices and offers a roadmap for its optimization in practical applications.

cond-mat.mtrl-sci↗