Interfacial-Thermo-Fluid-Adhesion Dynamics of Evaporating Capillary Bridges between Curved Surfaces
We probe the evaporation mechanism, and the associated adhesion dynamics of liquid capillary bridges connecting two curved, solid substrates. The coupled thermo fluid species transport and the transient evolution of capillary adhesion during evaporation are systematically examined. An accurate, fully coupled transient numerical framework is developed, wherein the equilibrium capillary profiles are first determined from level set method. Next, the evaporation is simulated via Arbitrary Lagrangian Eulerian ALE framework to accurately track the moving liquid vapor interface. The combined influence of substrate curvature, surface wettability, and solid thermal conductivity on evaporation and capillary adhesion character is comprehensively analysed. The simulation methodology is robustly validated against published literature for capillary profiles, evaporation rates, and capillary forces, demonstrating good agreement. Our results reveal that the evaporation characteristics of both hydrophilic and superhydrophobic SH liquid bridges are strongly governed by substrate curvature and thermal conductivity, and increasing values pose favourable condition for augmented interfacial mass transfer rate. The innately non uniform vapour flux generates spatially varying evaporative cooling, producing surface tension gradients that drive internal thermo capillary circulation. A non dimensional scaling analysis shows that Marangoni flow dominates buoyancy induced flow throughout. Also, increasing substrate curvature decreases the overall capillary force, owing to the reduced curvatures of the liquid bridge, while the temporal evolution of the adhesion force is strongly influenced by both substrate curvature and wettability.