arXiv subjects

B. Vermeersch

Publications and source records attributed to B. Vermeersch.

3 recordsLinked to original sources

arXiv2017

Predictive design and experimental realization of InAs/GaAs superlattices with tailored thermal conductivity

We demonstrate an ab-initio predictive approach to computing the thermal conductivity ($κ$) of InAs/GaAs superlattices (SLs) of varying period, thickness, and composition. Our new experimental results illustrate how this method can yield good agreement with experiment when realistic composition profiles are used as inputs for the theoretical model. Due to intrinsic limitations to the InAs thickness than can be grown, bulk-like SLs show limited sensitivity to the details of their composition profile, but the situation changes significantly when finite-thickness effects are considered. If In segregation could be minimized during the growth process, SLs with significantly higher $κ$ than that of the random alloy with the same composition would be obtained, with the potential to improve heat dissipation in InAs/GaAs-based devices.

cond-mat.mtrl-sci↗

arXiv2008

Application of Structure Functions for the Investigation of Forced Air Cooling

This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit model parameters necessary for numerical thermal simulations. The experiments demonstrated the influence of the wind speed on the value of the heat transfer coefficient and consequently on the temperature of the entire structure.

physics.gen-ph↗

arXiv2007

Dynamic Thermal Analysis of a Power Amplifier

This paper presents dynamic thermal analyses of a power amplifier. All the investigations are based on the transient junction temperature measurements performed during the circuit cooling process. The presented results include the cooling curves, the structure functions, the thermal time constant distribution and the Nyquist plot of the thermal impedance. The experiments carried out demonstrated the influence of the contact resistance and the position of the entire cooling assembly on the obtained results.

cond-mat.mtrl-sci↗