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Berkin Ulukutlu

Publications and source records attributed to Berkin Ulukutlu.

3 recordsLinked to original sources

Development and demonstration of the Korea ALICE Telescope using electron beams at KEK PF-AR

The development of ultra-low-mass, high-precision vertex detectors is a key requirement for future collider experiments and motivates extensive research and development of novel silicon tracking technologies. In this work, we present the development and beam-test demonstration of the Korea ALICE Telescope (KATS), a silicon-tracking telescope designed to support R&D on next-generation cylindrical vertex detectors, such as the proposed ALICE ITS3 upgrade. The telescope consists of six ALPIDE Monolithic Active Pixel Sensors (MAPS) used as reference tracking planes, a bent ALPIDE sensor serving as the device under test, and a scintillating-fiber-based trigger system, all housed in a light-tight modular enclosure. This setup enables precise track reconstruction and detailed performance studies of both planar and curved silicon sensors. Beam tests were carried out using high-energy electron beams at the KEK Photon Factory Advanced Ring (PF-AR). The telescope system operated stably under realistic beam conditions, and its tracking performance was successfully validated. The bent ALPIDE sensor was operated at a bending radius of approximately 18 mm, consistent with ITS3's design goals, without any observable degradation in detection performance. The measured results confirm that the KATS provides a versatile and reliable platform for studies of curved MAPS technologies, alignment precision, and tracking performance. These results provide important experimental validation of key technologies for future low-mass cylindrical silicon vertex detectors and establish KATS as a valuable facility for ongoing and future detector R&D.

physics.ins-det

Charge sharing and alignment performance of bent ALPIDEs measured with low-energy protons

The upgrade of the ALICE experiments Inner Tracking System (ITS3) aims to replace its innermost detection layers with bent wafer-scale CMOS MAPS sensors. This study examines the performance of ALPIDE chips, currently used in the ALICE ITS2, when operated in a bent configuration under realistic experimental conditions. Proton beams with energies of 80 MeV, 120 MeV and 200 MeV were used to study proton-proton elastic scattering on a polypropylene fiber target reconstructed using two opposing arms of trackers with sensors bent to radii of 18 mm, 24 mm and 30 mm. The measured low-momentum protons provided a testbed for investigating clustering behavior in high-energy loss events, where no significant impact of bending was observed on cluster size. Additionally, alignment strategies for bent detectors were evaluated using the distance of closest approach (DCA) and opening angle between scattered proton tracks as benchmarks. The achieved resolution matches expectations from simulations, confirming the suitability of bent MAPS sensors for future high-energy and nuclear physics applications.

physics.ins-det

Detection efficiency and spatial resolution of Monolithic Active Pixel Sensors bent to different radii

Bent monolithic active pixel sensors are the basis for the planned fully cylindrical ultra low material budget tracking detector ITS3 of the ALICE experiment. This paper presents results from testbeam campaigns using high-energy particles to verify the performance of 50 um thick bent ALPIDE chips in terms of efficiency and spatial resolution. The sensors were bent to radii of 18, 24 and 30 mm, slightly smaller than the foreseen bending radii of the future ALICE ITS3 layers. An efficiency larger than $99.9\%$ and a spatial resolution of approximately 5 um, in line with the nominal operation of flat ALPIDE sensors, is obtained at nominal operating conditions. These values are found to be independent of the bending radius and thus constitute an additional milestone in the demonstration of the feasibility of the planned ITS3 detector. In addition, a special geometry in which the beam particles graze the chip and traverse it laterally over distances of up to 3 mm is investigated.

physics.ins-det