arXiv subjects

Biresh Kumar Joardar

Publications and source records attributed to Biresh Kumar Joardar.

9 recordsLinked to original sources

arXiv2026

Building Reliable Arithmetic Multipliers Under NBTI Aging and Process Variations

Hardware aging poses a significant challenge for integrated circuits (ICs), leading to performance degradation and eventual failure. In this work, we focus on the aging of arithmetic multipliers, which are a cornerstone of modern computing systems including in CPUs, GPUs, and FPGAs, as well as AI accelerators like systolic arrays. In particular, AI workloads, which rely predominantly on multiplications, can accelerate Negative Bias Temperature Instability (NBTI) effects in multipliers. This paper presents a novel aging mitigation technique that leverages the signinvariance property of multiplication. By selectively applying 2s complement transformations to inputs, the method redistributes stress across transistors, reducing the effects of NBTI aging. The proposed method is also integrated into systolic arrays, a common AI accelerator, to demonstrate its efficiency in a high-throughput AI accelerator. Experimental evaluations using Cadence tools show better lifetime compared to natural aging (with no mitigation) baseline, while introducing negligible area and delay overheads.

cs.AR↗

arXiv2026

Attacking AI Accelerators by Leveraging Arithmetic Properties of Addition

The dependability of AI models relies largely on the reliability of the underlying computation hardware. Hardware aging attacks can compromise the computing substrate and disrupt AI models over the long run. In this work, we present a new hardware aging attack that exploits commutative properties of addition to disrupt the multiply-and-add operation that forms the backbone of almost all AI models. By permuting the inputs of an adder, the attack preserves functional correctness while inducing unbalanced stress among transistors, accelerating delay degradation in the circuit. Unlike prior approaches that rely on input manipulation, additional trojan circuitry, etc., the proposed method incurs virtually no area or software overhead. Experimental results with two types of multipliers, different bit widths, a mix of AI models and datasets demonstrates that the proposed attack degrades inference accuracy by up to 64% in 4 years, posing a significant threat to AI accelerators. The attack can also be extended to arithmetic units of general-purpose processors.

cs.CR↗

arXiv2025

HePGA: A Heterogeneous Processing-in-Memory based GNN Training Accelerator

Processing-In-Memory (PIM) architectures offer a promising approach to accelerate Graph Neural Network (GNN) training and inference. However, various PIM devices such as ReRAM, FeFET, PCM, MRAM, and SRAM exist, with each device offering unique trade-offs in terms of power, latency, area, and non-idealities. A heterogeneous manycore architecture enabled by 3D integration can combine multiple PIM devices on a single platform, to enable energy-efficient and high-performance GNN training. In this work, we propose a 3D heterogeneous PIM-based accelerator for GNN training referred to as HePGA. We leverage the unique characteristics of GNN layers and associated computing kernels to optimize their mapping on to different PIM devices as well as planar tiers. Our experimental analysis shows that HePGA outperforms existing PIM-based architectures by up to 3.8x and 6.8x in energy-efficiency (TOPS/W) and compute efficiency (TOPS/mm2) respectively, without sacrificing the GNN prediction accuracy. Finally, we demonstrate the applicability of HePGA to accelerate inferencing of emerging transformer models.

cs.ET↗

arXiv2024

FARe: Fault-Aware GNN Training on ReRAM-based PIM Accelerators

Resistive random-access memory (ReRAM)-based processing-in-memory (PIM) architecture is an attractive solution for training Graph Neural Networks (GNNs) on edge platforms. However, the immature fabrication process and limited write endurance of ReRAMs make them prone to hardware faults, thereby limiting their widespread adoption for GNN training. Further, the existing fault-tolerant solutions prove inadequate for effectively training GNNs in the presence of faults. In this paper, we propose a fault-aware framework referred to as FARe that mitigates the effect of faults during GNN training. FARe outperforms existing approaches in terms of both accuracy and timing overhead. Experimental results demonstrate that FARe framework can restore GNN test accuracy by 47.6% on faulty ReRAM hardware with a ~1% timing overhead compared to the fault-free counterpart.

cs.AR↗

arXiv2022

ReaLPrune: ReRAM Crossbar-aware Lottery Ticket Pruned CNNs

Training machine learning (ML) models at the edge (on-chip training on end user devices) can address many pressing challenges including data privacy/security, increase the accessibility of ML applications to different parts of the world by reducing the dependence on the communication fabric and the cloud infrastructure, and meet the real-time requirements of AR/VR applications. However, existing edge platforms do not have sufficient computing capabilities to support complex ML tasks such as training large CNNs. ReRAM-based architectures offer high-performance yet energy efficient computing platforms for on-chip CNN training/inferencing. However, ReRAM-based architectures are not scalable with the size of the CNN. Larger CNNs have more weights, which requires more ReRAM cells that cannot be integrated in a single chip. Moreover, training larger CNNs on-chip will require higher power, which cannot be afforded by these smaller devices. Pruning is an effective way to solve this problem. However, existing pruning techniques are either targeted for inferencing only, or they are not crossbar-aware. This leads to sub-optimal hardware savings and performance benefits for CNN training on ReRAM-based architectures. In this paper, we address this problem by proposing a novel crossbar-aware pruning strategy, referred as ReaLPrune, which can prune more than 90% of CNN weights. The pruned model can be trained from scratch without any accuracy loss. Experimental results indicate that ReaLPrune reduces hardware requirements by 77.2% and accelerates CNN training by ~20X compared to unpruned CNNs. ReaLPrune also outperforms other crossbar-aware pruning techniques in terms of both performance and hardware savings. In addition, ReaLPrune is equally effective for diverse datasets and more complex CNNs

cs.AR↗

arXiv2021

Multi-Objective Optimization of ReRAM Crossbars for Robust DNN Inferencing under Stochastic Noise

Resistive random-access memory (ReRAM) is a promising technology for designing hardware accelerators for deep neural network (DNN) inferencing. However, stochastic noise in ReRAM crossbars can degrade the DNN inferencing accuracy. We propose the design and optimization of a high-performance, area-and energy-efficient ReRAM-based hardware accelerator to achieve robust DNN inferencing in the presence of stochastic noise. We make two key technical contributions. First, we propose a stochastic-noise-aware training method, referred to as ReSNA, to improve the accuracy of DNN inferencing on ReRAM crossbars with stochastic noise. Second, we propose an information-theoretic algorithm, referred to as CF-MESMO, to identify the Pareto set of solutions to trade-off multiple objectives, including inferencing accuracy, area overhead, execution time, and energy consumption. The main challenge in this context is that executing the ReSNA method to evaluate each candidate ReRAM design is prohibitive. To address this challenge, we utilize the continuous-fidelity evaluation of ReRAM designs associated with prohibitive high computation cost by varying the number of training epochs to trade-off accuracy and cost. CF-MESMO iteratively selects the candidate ReRAM design and fidelity pair that maximizes the information gained per unit computation cost about the optimal Pareto front. Our experiments on benchmark DNNs show that the proposed algorithms efficiently uncover high-quality Pareto fronts. On average, ReSNA achieves 2.57% inferencing accuracy improvement for ResNet20 on the CIFAR-10 dataset with respect to the baseline configuration. Moreover, CF-MESMO algorithm achieves 90.91% reduction in computation cost compared to the popular multi-objective optimization algorithm NSGA-II to reach the best solution from NSGA-II.

cs.ET↗

arXiv2021

ReGraphX: NoC-enabled 3D Heterogeneous ReRAM Architecture for Training Graph Neural Networks

Graph Neural Network (GNN) is a variant of Deep Neural Networks (DNNs) operating on graphs. However, GNNs are more complex compared to traditional DNNs as they simultaneously exhibit features of both DNN and graph applications. As a result, architectures specifically optimized for either DNNs or graph applications are not suited for GNN training. In this work, we propose a 3D heterogeneous manycore architecture for on-chip GNN training to address this problem. The proposed architecture, ReGraphX, involves heterogeneous ReRAM crossbars to fulfill the disparate requirements of both DNN and graph computations simultaneously. The ReRAM-based architecture is complemented with a multicast-enabled 3D NoC to improve the overall achievable performance. We demonstrate that ReGraphX outperforms conventional GPUs by up to 3.5X (on an average 3X) in terms of execution time, while reducing energy consumption by as much as 11X.

cs.AR↗

arXiv2020

HeM3D: Heterogeneous Manycore Architecture Based on Monolithic 3D Vertical Integration

Heterogeneous manycore architectures are the key to efficiently execute compute- and data-intensive applications. Through silicon via (TSV)-based 3D manycore system is a promising solution in this direction as it enables integration of disparate computing cores on a single system. However, the achievable performance of conventional through-silicon-via (TSV)-based 3D systems is ultimately bottlenecked by the horizontal wires (wires in each planar die). Moreover, current TSV 3D architectures suffer from thermal limitations. Hence, TSV-based architectures do not realize the full potential of 3D integration. Monolithic 3D (M3D) integration, a breakthrough technology to achieve - More Moore and More Than Moore - and opens up the possibility of designing cores and associated network routers using multiple layers by utilizing monolithic inter-tier vias (MIVs) and hence, reducing the effective wire length. Compared to TSV-based 3D ICs, M3D offers the true benefits of vertical dimension for system integration: the size of a MIV used in M3D is over 100x smaller than a TSV. In this work, we demonstrate how M3D-enabled vertical core and uncore elements offer significant performance and thermal improvements in manycore heterogeneous architectures compared to its TSV-based counterpart. To overcome the difficult optimization challenges due to the large design space and complex interactions among the heterogeneous components (CPU, GPU, Last Level Cache, etc.) in an M3D-based manycore chip, we leverage novel design-space exploration algorithms to trade-off different objectives. The proposed M3D-enabled heterogeneous architecture, called HeM3D, outperforms its state-of-the-art TSV-equivalent counterpart by up to 18.3% in execution time while being up to 19 degrees Celcius cooler.

cs.AR↗

arXiv2019

Learning-based Application-Agnostic 3D NoC Design for Heterogeneous Manycore Systems

The rising use of deep learning and other big-data algorithms has led to an increasing demand for hardware platforms that are computationally powerful, yet energy-efficient. Due to the amount of data parallelism in these algorithms, high-performance 3D manycore platforms that incorporate both CPUs and GPUs present a promising direction. However, as systems use heterogeneity (e.g., a combination of CPUs, GPUs, and accelerators) to improve performance and efficiency, it becomes more pertinent to address the distinct and likely conflicting communication requirements (e.g., CPU memory access latency or GPU network throughput) that arise from such heterogeneity. Unfortunately, it is difficult to quickly explore the hardware design space and choose appropriate tradeoffs between these heterogeneous requirements. To address these challenges, we propose the design of a 3D Network-on-Chip (NoC) for heterogeneous manycore platforms that considers the appropriate design objectives for a 3D heterogeneous system and explores various tradeoffs using an efficient ML-based multi-objective optimization technique. The proposed design space exploration considers the various requirements of its heterogeneous components and generates a set of 3D NoC architectures that efficiently trades off these design objectives. Our findings show that by jointly considering these requirements (latency, throughput, temperature, and energy), we can achieve 9.6% better Energy-Delay Product on average at nearly iso-temperature conditions when compared to a thermally-optimized design for 3D heterogeneous NoCs. More importantly, our results suggest that our 3D NoCs optimized for a few applications can be generalized for unknown applications as well. Our results show that these generalized 3D NoCs only incur a 1.8% (36-tile system) and 1.1% (64-tile system) average performance loss compared to application-specific NoCs.

cs.DC↗