SearcharxivSearch

arXiv subjects

C. Brito

Publications and source records attributed to C. Brito.

3 recordsLinked to original sources

Beam-test evaluation of pre-production Low Gain Avalanche Detectors for the ATLAS High Granularity Timing Detector

The High Granularity Timing Detector (HGTD) will be installed in the ATLAS experiment as part of the Phase-II upgrade for the High Luminosity-Large Hadron Collider (HL-LHC). It will mitigate pile-up effects in the forward region, and measure per bunch luminosity. The design of HGTD is based on Low Gain Avalanche Detector (LGAD) sensors. This paper presents the results of beam-test campaigns conducted at CERN and DESY in 2023 and 2024 on single LGADs from HGTD pre-production test structures, before and after neutron irradiation up to fluences of $2.5 \times 10^{15}~\mathrm{n_{eq}/cm^2}$. The tested LGADs can meet HGTD requirements in terms of charge collection, time resolution, and hit efficiency, even under HL-LHC end-of-life conditions, supporting their deployment in the final detector.

physics.ins-det

Thermal Cycling Reliability of Hybrid Pixel Sensor Modules for The ATLAS High Granularity Timing Detector

The reliability of bump connection structures has become a critical aspect of future silicon detectors for particle physics. The High Granularity Timing Detector (HGTD) for the ATLAS experiment at the High-Luminosity Large Hadron Collider will require 8032 hybrid pixel sensor modules, composed of two Low Gain Avalanche Diode sensors bump-bonded to two readout ASICs and glued to a passive PCB. The detector will operate at low temperature (-30 degrees Celsius) to mitigate the impact of irradiation. The thermomechanical reliability of flip-chip bump connections in HGTD modules is a critical concern, particularly due to their characteristically lower bump density (pixel pitch dimensions of 1.3 mm by 1.3 mm). This paper elaborates on the challenges arising from this design characteristic. Finite element analysis and experimental testing were employed to investigate failure modes in the flip-chip bump structures under thermal cycling from -45 degrees Celsius to 40 degrees Celsius and to guide the module redesign. The optimized design demonstrates significantly enhanced robustness and is projected to fulfill the full lifetime requirements of the HGTD.

physics.ins-det

The distribution of forces affects vibrational properties in hard sphere glasses

We study theoretically and numerically the elastic properties of hard sphere glasses, and provide a real-space description of their mechanical stability. In contrast to repulsive particles at zero-temperature, we argue that the presence of certain pairs of particles interacting with a small force $f$ soften elastic properties. This softening affects the exponents characterizing elasticity at high pressure, leading to experimentally testable predictions. Denoting $P(f)\sim f^{θ_e}$ the force distribution of such pairs and $ϕ_c$ the packing fraction at which pressure diverges, we predict that (i) the density of states has a low-frequency peak at a scale $ω^*$, rising up to it as $D(ω) \sim ω^{2+a}$, and decaying above $ω^*$ as $D(ω)\sim ω^{-a}$ where $a=(1-θ_e)/(3+θ_e)$ and $ω$ is the frequency, (ii) shear modulus and mean-squared displacement are inversely proportional with $\langle δR^2\rangle\sim1/μ\sim (ϕ_c-ϕ)^κ $ where $κ=2-2/(3+θ_e)$, and (iii) continuum elasticity breaks down on a scale $\ell_c \sim1/\sqrt{δz}\sim (ϕ_c-ϕ)^{-b}$ where $b=(1+θ_e)/(6+2θ_e)$ and $δz=z-2d$, where $z$ is the coordination and $d$ the spatial dimension. We numerically test (i) and provide data supporting that $θ_e\approx 0.41$ in our bi-disperse system, independently of system preparation in two and three dimensions, leading to $κ\approx1.41$, $a \approx 0.17$, and $b\approx 0.21$. Our results for the mean-square displacement are consistent with a recent exact replica computation for $d=\infty$, whereas some observations differ, as rationalized by the present approach.

cond-mat.soft