arXiv subjects

Cheng-Lin Deng

Publications and source records attributed to Cheng-Lin Deng.

21 records · Page 2Linked to original sources

arXiv2023

Simulating Chern insulators on a superconducting quantum processor

The quantum Hall effect, fundamental in modern condensed matter physics, continuously inspires new theories and predicts emergent phases of matter. Here we experimentally demonstrate three types of Chern insulators with synthetic dimensions on a programable 30-qubit-ladder superconducting processor. We directly measure the band structures of the 2D Chern insulator along synthetic dimensions with various configurations of Aubry-André-Harper chains and observe dynamical localisation of edge excitations. With these two signatures of topology, our experiments implement the bulk-edge correspondence in the synthetic 2D Chern insulator. Moreover, we simulate two different bilayer Chern insulators on the ladder-type superconducting processor. With the same and opposite periodically modulated on-site potentials for two coupled chains, we simulate topologically nontrivial edge states with zero Hall conductivity and a Chern insulator with higher Chern numbers, respectively. Our work shows the potential of using superconducting qubits for investigating different intriguing topological phases of quantum matter.

quant-ph↗

arXiv2023

Quantum simulation of topological zero modes on a 41-qubit superconducting processor

Quantum simulation of different exotic topological phases of quantum matter on a noisy intermediate-scale quantum (NISQ) processor is attracting growing interest. Here, we develop a one-dimensional 43-qubit superconducting quantum processor, named as Chuang-tzu, to simulate and characterize emergent topological states. By engineering diagonal Aubry-Andr$\acute{\mathrm{e}}$-Harper (AAH) models, we experimentally demonstrate the Hofstadter butterfly energy spectrum. Using Floquet engineering, we verify the existence of the topological zero modes in the commensurate off-diagonal AAH models, which have never been experimentally realized before. Remarkably, the qubit number over 40 in our quantum processor is large enough to capture the substantial topological features of a quantum system from its complex band structure, including Dirac points, the energy gap's closing, the difference between even and odd number of sites, and the distinction between edge and bulk states. Our results establish a versatile hybrid quantum simulation approach to exploring quantum topological systems in the NISQ era.

quant-ph↗

arXiv2023

Tunable Coupling Architectures with Capacitively Connecting Pads for Large-Scale Superconducting Multi-Qubit Processors

We have proposed and experimentally verified a tunable inter-qubit coupling scheme for large-scale integration of superconducting qubits. The key feature of the scheme is the insertion of connecting pads between qubit and tunable coupling element. In such a way, the distance between two qubits can be increased considerably to a few millimeters, leaving enough space for arranging control lines, readout resonators and other necessary structures. The increased inter-qubit distance provides more wiring space for flip-chip process and reduces crosstalk between qubits and from control lines to qubits. We use the term Tunable Coupler with Capacitively Connecting Pad (TCCP) to name the tunable coupling part that consists of a transmon coupler and capacitively connecting pads. With the different placement of connecting pads, different TCCP architectures can be realized. We have designed and fabricated a few multi-qubit devices in which TCCP is used for coupling. The measured results show that the performance of the qubits coupled by the TCCP, such as $T_1$ and $T_2$, was similar to that of the traditional transmon qubits without TCCP. Meanwhile, our TCCP also exhibited a wide tunable range of the effective coupling strength and a low residual ZZ interaction between the qubits by properly tuning the parameters on the design. Finally, we successfully implemented an adiabatic CZ gate with TCCP. Furthermore, by introducing TCCP, we also discuss the realization of the flip-chip process and tunable coupling qubits between different chips.

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