XeF$_2$-Enhanced Focused Ion Beam Etching and Passivation of GaSb
Focused ion beams (FIBs) are widely used to modify optoelectronic devices, but their utility is severely restricted in some III-V materials due to adverse effects such as nanofibre growth and contamination. This study describes an effective machining method for the modification and passivation of GaSb using a focused Ga$^+$ beam with the addition of XeF$_2$ gas. The added gas suppressed the nanofibre growth and allowed for controlled etching. Moreover, the milled surface exhibited much lower roughness and contained much lower levels of carbon and oxygen contaminants. These effects are attributed to the formation of a gallium fluoride layer, which inhibits the catalytic vapour-liquid-solid (VLS) nanofibre growth. The fluoride layer prevents the surface oxidation, acting as an effective passivation layer. This gas-assisted FIB process eliminates the idiosyncratic challenges of modifying GaSb with an ion beam and it can be implemented cost-effectively and rapidly in conventional FIB systems---allowing for site-specific modification of bespoke GaSb-based devices.