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Davide Orlandini

Publications and source records attributed to Davide Orlandini.

2 recordsLinked to original sources

Electrostatic Effects of Self Trapped Holes in Gallium Oxide Devices

Gallium oxide is an ultra-wide bandgap semiconductor with exceptional properties for power electronics and UV-C optoelectronics, but its behavior under illumination remains poorly understood. In this work, we investigate how optically generated self-trapped holes influence electrostatics and current conduction in gallium oxide devices. Using a vertical Schottky photodiode with a semi-transparent Ni anode, we performed capacitance-voltage, current-voltage, and temperature-dependent I-V measurements under dark and above-bandgap illumination. Analysis of photocurrent gain reveals that conventional image-force barrier-lowering models require unrealistically high interfacial electric fields, suggesting the presence of an alternative mechanism. By applying Fowler-Nordheim tunneling theory, we reconcile measured photocurrents and photo-capacitance results with physically plausible fields and quantify the two-dimensional concentration of self-trapped holes. Our findings demonstrate that illumination-induced charge significantly alters device electrostatics. Understanding this tunneling-based photocurrent gain mechanism is critical for designing gallium oxide devices for UV-C detectors and power electronics.

cond-mat.mtrl-sci

Extremely Low Thermal Resistance Architectures for AlxGaN1-x Semiconductor Devices

Next-generation high-power radio-frequency (RF) devices increasingly demand transistors that operate efficiently with high gain at high frequencies. High-aluminum-content ultra-wide-bandgap (UWBG) AlGaN alloys have shown great potential for enabling such high-frequency RF technologies. However, the widespread adoption of AlGaN-based RF devices is limited by thermal-management challenges arising from the intrinsically low thermal conductivity of AlGaN, which leads to higher device thermal resistance for a given geometry compared to GaN RF devices. As a result, these next-generation devices are highly susceptible to self-heating. This study investigates the thermal behavior of UWBG AlGaN devices, focusing on the effects of AlGaN channel thickness, substrate technology, and high-k material integration on reducing device thermal resistance to enable high-power operation. Experimental results demonstrate a record-low thermal resistance of 3.96 mm$\cdot$K/W when an AlN substrate is employed and the AlGaN channel thickness is reduced to 5 nm. These findings provide valuable insights into mitigating thermal limitations in UWBG devices through device-level engineering and the strategic integration of high-k materials.

physics.app-ph