arXiv subjects

Emily M. Garrity

Publications and source records attributed to Emily M. Garrity.

3 recordsLinked to original sources

arXiv2025

Epitaxial growth and semiconductor properties of NiGa2O4 spinel for Ga2O3/NiO interfaces

Unintentionally formed interfacial layers are ubiquitous in semiconductor devices that operate at extreme conditions. However, these layers' structure and properties often remain unknown due to the thinness of these naturally formed interphases. Here, we report on the intentional epitaxial growth and semiconductor properties of NiGa2O4 spinel layers that form at Ga2O3/NiO interfaces used in high-power and high-temperature electronic devices. Cubic spinel NiGa2O4 films of 10-50 nm thicknesses and low surface roughness (~ 2 nm) were grown using pulsed laser deposition at a substrate temperatures in the 300-900 °C range on α-Al2O3 and β-Ga2O3 substrates of different orientation. The optical absorption onset (3.6-3.9 eV) and thermal conductivity (4-9 W m-1 K-1) vary systematically with substrate temperature, consistent with theoretical predictions of varying Ni and Ga cation ordering on the spinel lattice. The valence band offset between NiGa2O4 and β-Ga2O3 is determined to be 1.8 eV. The NiGa2O4-based p-n heterojunction devices on Ga2O3 (001) substrates exhibit a rectification ratio of 10^8 (for +/-2V) and a turn-on voltage of 1.4 V, maintaining diode behavior up to 600 °C. These results highlight the potential of NiGa2O4 as a p-type interlayer in Ga2O3-based devices and shows a new approach to investigate such interfacial layers.

cond-mat.mtrl-sci↗

arXiv2025

Emerging ultra-wide band gap semiconductors for future high-frequency electronics

To meet the growing demands of advanced electronic systems, next-generation power and RF semiconductor devices must operate efficiently at higher power levels and switching frequencies while remaining compact. Current state-of-the-art GaN semiconductor devices alone cannot meet all these demands. Emerging ultra-wide band gap (UWBG) alternatives like diamond, BN, AlN, and Ga2O3, face significant challenges including limited wafer availability, doping difficulties, and thermal management constraints. Herein we conduct a high-throughput computational screening for new semiconductors for high-frequency electronics. In our analysis we compute the modeled Johnson and Baliga high-frequency figures of merit in combination with thermal conductivity to assess their potential for RF and power devices. We show that there are plenty of alternative materials to explore and conclude by discussing dopability and synthesis of select candidate materials. This study lays the foundation for discovering new semiconductors that can push the boundaries of performance in applications ranging from EV chargers and solid-state transformers to sub-THz communications and advanced radar technologies.

cond-mat.mtrl-sci↗

arXiv2024

NiGa$_{2}$O$_{4}$ interfacial layers in NiO/Ga$_{2}$O$_{3}$ heterojunction diodes at high temperature

NiO/Ga$_{2}$O$_{3}$ heterojunction diodes have attracted attention for high-power applications, but their high-temperature performance and reliability remain underexplored. Here we report on the time evolution of the static electrical properties in the widely studied p-NiO/n-Ga$_{2}$O$_{3}$heterojunction diodes and the formation of NiGa$_{2}$O$_{4}$ interfacial layers when operated at $550^{\circ}$C. Results of our thermal cycling experiment show an initial leakage current increase which stabilizes after sustained thermal load, due to reactions at the NiO-Ga$_{2}$O$_{3}$ interface. High-resolution TEM microstructure analysis of the devices after thermal cycling indicates that the NiO-Ga$_{2}$O$_{3}$ interface forms ternary compounds at high temperatures, and thermodynamic calculations suggest the formation of the spinel NiGa$_{2}$O$_{4}$ layer between NiO and Ga$_{2}$O$_{3}$. First-principles defect calculations find that NiGa$_{2}$O$_{4}$ shows low p-type intrinsic doping, and hence can also serve to limit electric field crowding at the interface. Vertical NiO/Ga$_{2}$O$_{3}$ diodes with intentionally grown 5 nm thin spinel-type NiGa$_{2}$O$_{4}$ interfacial layers show excellent device ON/OFF ratio of > 10$^{10}$($\pm$3 V), V$_{ON}$ of ~1.9 V, and breakdown voltage of ~ 1.2 kV for an initial unoptimized 300-micron diameter device. These p-n heterojunction diodes are promising for high-voltage, high-temperature applications.

cond-mat.mtrl-sci↗