arXiv subjects

Eren Kurshan

Publications and source records attributed to Eren Kurshan.

17 recordsLinked to original sources

arXiv2025

The Agentic Regulator: Risks for AI in Finance and a Proposed Agent-based Framework for Governance

Generative and agentic artificial intelligence is entering financial markets faster than existing governance can adapt. Current model-risk frameworks assume static, well-specified algorithms and one-time validations; large language models and multi-agent trading systems violate those assumptions by learning continuously, exchanging latent signals, and exhibiting emergent behavior. Drawing on complex adaptive systems theory, we model these technologies as decentralized ensembles whose risks propagate along multiple time-scales. We then propose a modular governance architecture. The framework decomposes oversight into four layers of "regulatory blocks": (i) self-regulation modules embedded beside each model, (ii) firm-level governance blocks that aggregate local telemetry and enforce policy, (iii) regulator-hosted agents that monitor sector-wide indicators for collusive or destabilizing patterns, and (iv) independent audit blocks that supply third-party assurance. Eight design strategies enable the blocks to evolve as fast as the models they police. A case study on emergent spoofing in multi-agent trading shows how the layered controls quarantine harmful behavior in real time while preserving innovation. The architecture remains compatible with today's model-risk rules yet closes critical observability and control gaps, providing a practical path toward resilient, adaptive AI governance in financial systems.

cs.CY↗

arXiv2025

3D Guard-Layer: An Integrated Agentic AI Safety System for Edge Artificial Intelligence

AI systems have found a wide range of real-world applications in recent years. The adoption of edge artificial intelligence, embedding AI directly into edge devices, is rapidly growing. Despite the implementation of guardrails and safety mechanisms, security vulnerabilities and challenges have become increasingly prevalent in this domain, posing a significant barrier to the practical deployment and safety of AI systems. This paper proposes an agentic AI safety architecture that leverages 3D to integrate a dedicated safety layer. It introduces an adaptive AI safety infrastructure capable of dynamically learning and mitigating attacks against the AI system. The system leverages the inherent advantages of co-location with the edge computing hardware to continuously monitor, detect and proactively mitigate threats to the AI system. The integration of local processing and learning capabilities enhances resilience against emerging network-based attacks while simultaneously improving system reliability, modularity, and performance, all with minimal cost and 3D integration overhead.

cs.AR↗

arXiv2025

Opportunities and Challenges for 3D Systems and Their Design

Although it is not a new concept, 3D integration increasingly receives widespread interest and focus as lithographic scaling becomes more challenging, and as the ability to make miniature vias greatly improves. Like Moores law, 3D integration improves density. With improvements in packaging density, however, come the challenges associated with its inherently higher power density. And though it acts somewhat as a scaling accelerator, the vertical integration also poses new challenges to design and manufacturing technologies. The placement of circuits, vias, and macros in the planes of a 3D stack must be co-designed across layers (or must conform to new standards) so that, when assembled, they have correct spatial correspondence. Each layer, although perhaps being a mere functional slice through a system (and we can slice the system in many different ways), must be independently testable so that we can systematically test and diagnose subsystems before and after final assembly. When those layers are assembled, they must come together in a way that enables a sensible yield and facilitates testing the finished product. To make the most of 3D integration, we should articulate the leverages of 3D systems (other researchers offer a more complete treatment elsewhere). Then we can enumerate and elucidate many of the new challenges posed by the design, assembly, and test of 3D systems.

cs.AR↗

arXiv2025

Thermal-Aware 3D Design for Side-Channel Information Leakage

Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to disclose the activities of key functional blocks and even encryption keys. This paper proposes a novel approach to proactively conceal critical activities in the functional layers while minimizing the power dissipation by (i) leveraging inherent characteristics of 3D integration to protect from side-channel attacks and (ii) dynamically generating custom activity patterns to match the activity to be concealed in the functional layers. Experimental analysis shows that 3D technology combined with the proposed run-time algorithm effectively reduces the Side channel vulnerability Factor (SVF) below 0.05 and the Spatial Thermal Side-channel Factor (STSF) below 0.59.

cs.CR↗

arXiv2025

Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits

3-D integrated circuits (3-D ICs) offer performance advantages due to their increased bandwidth and reduced wire-length enabled by through-silicon-via structures (TSVs). Traditionally TSVs have been considered to improve the thermal conductivity in the vertical direction. However, the lateral thermal blockage effect becomes increasingly important for TSV via farms (a cluster of TSV vias used for signal bus connections between layers) because the TSV size and pitch continue to scale in μm range and the metal to insulator ratio becomes smaller. Consequently, dense TSV farms can create lateral thermal blockages in thinned silicon substrate and exacerbate the local hotspots. In this paper, we propose a thermal-aware via farm placement technique for 3-D ICs to minimize lateral heat blockages caused by dense signal bus TSV structures.

cs.AR↗

arXiv2025

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration

Most previous 3D IC research focused on stacking traditional 2D silicon layers, so the interconnect reduction is limited to inter-block delays. In this paper, we propose techniques that enable efficient exploration of the 3D design space where each logical block can span more than one silicon layers. Although further power and performance improvement is achievable through fine grain 3D integration, the necessary modeling and tool infrastructure has been mostly missing. We develop a cube packing engine which can simultaneously optimize physical and architectural design for effective utilization of 3D in terms of performance, area and temperature. Our experimental results using a design driver show 36% performance improvement (in BIPS) over 2D and 14% over 3D with single layer blocks. Additionally multi-layer blocks can provide up to 30% reduction in power dissipation compared to the single-layer alternatives. Peak temperature of the design is kept within limits as a result of thermal-aware floorplanning and thermal via insertion techniques.

cs.AR↗

arXiv2025

From the Pursuit of Universal AGI Architecture to Systematic Approach to Heterogenous AGI: Addressing Alignment, Energy, & AGI Grand Challenges

Artificial intelligence (AI) faces a trifecta of grand challenges: the Energy Wall, the Alignment Problem and the Leap from Narrow AI to AGI. We present SAGI, a Systematic Approach to AGI that utilizes system design principles to overcome the energy wall and alignment challenges. This paper asserts that AGI can be realized through multiplicity of design specific pathways and customized through system design rather than a singular overarching architecture. AGI systems may exhibit diver architectural configurations and capabilities, contingent upon their intended use cases. Alignment, a challenge broadly recognized as AIs most formidable, is the one that depends most critically on system design and serves as its primary driving force as a foundational criterion for AGI. Capturing the complexities of human morality for alignment requires architectural support to represent the intricacies of moral decision-making and the pervasive ethical processing at every level, with performance reliability exceeding that of human moral judgment. Hence, requiring a more robust architecture towards safety and alignment goals, without replicating or resembling the human brain. We argue that system design (such as feedback loops, energy and performance optimization) on learning substrates (capable of learning its system architecture) is more fundamental to achieving AGI goals and guarantees, superseding classical symbolic, emergentist and hybrid approaches. Through learning of the system architecture itself, the resulting AGI is not a product of spontaneous emergence but of systematic design and deliberate engineering, with core features, including an integrated moral architecture, deeply embedded within its architecture. The approach aims to guarantee design goals such as alignment, efficiency by self-learning system architecture.

cs.AI↗

arXiv2024

AI versus AI in Financial Crimes and Detection: GenAI Crime Waves to Co-Evolutionary AI

Adoption of AI by criminal entities across traditional and emerging financial crime paradigms has been a disturbing recent trend. Particularly concerning is the proliferation of generative AI, which has empowered criminal activities ranging from sophisticated phishing schemes to the creation of hard-to-detect deep fakes, and to advanced spoofing attacks to biometric authentication systems. The exploitation of AI by criminal purposes continues to escalate, presenting an unprecedented challenge. AI adoption causes an increasingly complex landscape of fraud typologies intertwined with cybersecurity vulnerabilities. Overall, GenAI has a transformative effect on financial crimes and fraud. According to some estimates, GenAI will quadruple the fraud losses by 2027 with a staggering annual growth rate of over 30% [27]. As crime patterns become more intricate, personalized, and elusive, deploying effective defensive AI strategies becomes indispensable. However, several challenges hinder the necessary progress of AI-based fincrime detection systems. This paper examines the latest trends in AI/ML-driven financial crimes and detection systems. It underscores the urgent need for developing agile AI defenses that can effectively counteract the rapidly emerging threats. It also aims to highlight the need for cooperation across the financial services industry to tackle the GenAI induced crime waves.

cs.LG↗

arXiv2024

3D System Design: A Case for Building Customized Modular Systems in 3D

3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the underlying technology continues to evolve, the unique leverages of 3D have become increasingly appealing to a larger range of applications: from embedded mobile applications to servers and memory systems. In this paper we focus on the system-level implications of 3D technology, trying to differentiate the unique advantages that it provides to different market segments and applications.

cs.DC↗

arXiv2024

Is 3D chip technology the next growth engine for performance improvement?

The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in how computer systems are designed, implemented, scaled, and used. Since Moores Law, which has driven the evolution in systems for the last several decades, is imminently approaching real and severe limitations, the ability to create three-dimensional,3D, device stacks appears promising as a way to continue to integrate more devices into a chip.While on the one hand, this nascent ability to make 3D technology can be interpreted as merely an extension of Moores Law, on the other hand, the fact that systems can now be integrated across multiple planes poses some novel opportunities, as well as serious challenges and questions. In this paper, we explore these various challenges and opportunities and discuss structures and systems that are likely to be facilitated by 3D technology. We also describe the ways in which these systems are likely to change. Since 3D technology offers some different value propositions, we expect that some of the most important ways in which 3D technology will likely impact our approach to future systems design, implementation, and usage are not yet obvious to most system designers, and we outline several of them.

cs.ET↗

arXiv2024

Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems

3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and disparate technologies, eliminates off-chip communication constraints, reduces on-chip latency and total power dissipation. Moreover, AIs demand for increased computational power, larger GPU cache capacity, energy efficiency and low power custom AI hardware integration all serve as drivers for 3D integration. Although 3D advantages such as enhanced interconnectivity and increased performance have been demonstrated through numerous technology sites, heterogeneous 3D system design raises numerous unanswered questions. Among the primary challenges are the temperature and lifetime reliability issues caused by the complex interaction patterns among system components. Such interactions are harder to model with current modeling tools and require detailed hardware characterization. This study presents the latest drivers for 3D integration and the resulting need for hardware emulation frameworks. It then presents a design to profile power, temperature, noise, inter-layer bandwidth and lifetime reliability characterization that can emulate a wide range of stacking alternatives. This framework allows for controlling activity levels at the macro-level, along with customized sensor infrastructure to characterize heat propagation, inter-layer noise, power delivery, reliability and inter-connectivity as well as the interactions among critical design objectives.

cs.ET↗

arXiv2023

Temporal Knowledge Distillation for Time-Sensitive Financial Services Applications

Detecting anomalies has become an increasingly critical function in the financial service industry. Anomaly detection is frequently used in key compliance and risk functions such as financial crime detection fraud and cybersecurity. The dynamic nature of the underlying data patterns especially in adversarial environments like fraud detection poses serious challenges to the machine learning models. Keeping up with the rapid changes by retraining the models with the latest data patterns introduces pressures in balancing the historical and current patterns while managing the training data size. Furthermore the model retraining times raise problems in time-sensitive and high-volume deployment systems where the retraining period directly impacts the models ability to respond to ongoing attacks in a timely manner. In this study we propose a temporal knowledge distillation-based label augmentation approach (TKD) which utilizes the learning from older models to rapidly boost the latest model and effectively reduces the model retraining times to achieve improved agility. Experimental results show that the proposed approach provides advantages in retraining times while improving the model performance.

cs.LG↗

arXiv2021

On the Current and Emerging Challenges of Developing Fair and Ethical AI Solutions in Financial Services

Artificial intelligence (AI) continues to find more numerous and more critical applications in the financial services industry, giving rise to fair and ethical AI as an industry-wide objective. While many ethical principles and guidelines have been published in recent years, they fall short of addressing the serious challenges that model developers face when building ethical AI solutions. We survey the practical and overarching issues surrounding model development, from design and implementation complexities, to the shortage of tools, and the lack of organizational constructs. We show how practical considerations reveal the gaps between high-level principles and concrete, deployed AI applications, with the aim of starting industry-wide conversations toward solution approaches.

cs.CY↗

arXiv2021

Beyond Fairness Metrics: Roadblocks and Challenges for Ethical AI in Practice

We review practical challenges in building and deploying ethical AI at the scale of contemporary industrial and societal uses. Apart from the purely technical concerns that are the usual focus of academic research, the operational challenges of inconsistent regulatory pressures, conflicting business goals, data quality issues, development processes, systems integration practices, and the scale of deployment all conspire to create new ethical risks. Such ethical concerns arising from these practical considerations are not adequately addressed by existing research results. We argue that a holistic consideration of ethics in the development and deployment of AI systems is necessary for building ethical AI in practice, and exhort researchers to consider the full operational contexts of AI systems when assessing ethical risks.

cs.LG↗

arXiv2021

A Case for 3D Integrated System Design for Neuromorphic Computing & AI Applications

Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlighted the need to address performance and energy efficiency challenges faced during the implementation process. To address these challenges, there has been growing interest in neuromorphic chips. Neuromorphic computing relies on non von Neumann architectures as well as novel devices, circuits and manufacturing technologies to mimic the human brain. Among such technologies, 3D integration is an important enabler for AI hardware and the continuation of the scaling laws. In this paper, we overview the unique opportunities 3D integration provides in neuromorphic chip design, discuss the emerging opportunities in next generation neuromorphic architectures and review the obstacles. Neuromorphic architectures, which relied on the brain for inspiration and emulation purposes, face grand challenges due to the limited understanding of the functionality and the architecture of the human brain. Yet, high-levels of investments are dedicated to develop neuromorphic chips. We argue that 3D integration not only provides strategic advantages to the cost-effective and flexible design of neuromorphic chips, it may provide design flexibility in incorporating advanced capabilities to further benefits the designs in the future.

cs.ET↗

arXiv2020

Deep Q-Network-based Adaptive Alert Threshold Selection Policy for Payment Fraud Systems in Retail Banking

Machine learning models have widely been used in fraud detection systems. Most of the research and development efforts have been concentrated on improving the performance of the fraud scoring models. Yet, the downstream fraud alert systems still have limited to no model adoption and rely on manual steps. Alert systems are pervasively used across all payment channels in retail banking and play an important role in the overall fraud detection process. Current fraud detection systems end up with large numbers of dropped alerts due to their inability to account for the alert processing capacity. Ideally, alert threshold selection enables the system to maximize the fraud detection while balancing the upstream fraud scores and the available bandwidth of the alert processing teams. However, in practice, fixed thresholds that are used for their simplicity do not have this ability. In this paper, we propose an enhanced threshold selection policy for fraud alert systems. The proposed approach formulates the threshold selection as a sequential decision making problem and uses Deep Q-Network based reinforcement learning. Experimental results show that this adaptive approach outperforms the current static solutions by reducing the fraud losses as well as improving the operational efficiency of the alert system.

cs.LG↗

arXiv2020

Towards Self-Regulating AI: Challenges and Opportunities of AI Model Governance in Financial Services

AI systems have found a wide range of application areas in financial services. Their involvement in broader and increasingly critical decisions has escalated the need for compliance and effective model governance. Current governance practices have evolved from more traditional financial applications and modeling frameworks. They often struggle with the fundamental differences in AI characteristics such as uncertainty in the assumptions, and the lack of explicit programming. AI model governance frequently involves complex review flows and relies heavily on manual steps. As a result, it faces serious challenges in effectiveness, cost, complexity, and speed. Furthermore, the unprecedented rate of growth in the AI model complexity raises questions on the sustainability of the current practices. This paper focuses on the challenges of AI model governance in the financial services industry. As a part of the outlook, we present a system-level framework towards increased self-regulation for robustness and compliance. This approach aims to enable potential solution opportunities through increased automation and the integration of monitoring, management, and mitigation capabilities. The proposed framework also provides model governance and risk management improved capabilities to manage model risk during deployment.

cs.LG↗