SearcharxivSearch

arXiv subjects

Eric X. Liu

Publications and source records attributed to Eric X. Liu.

2 recordsLinked to original sources

ITHICA: Intra-Thread Instruction Checking Approach for Defect-Induced Silent Data Corruptions

Hyperscaler reports of silent data corruptions (SDCs), presumed to be caused by silicon manufacturing defects, have motivated the development of functional tests for detecting defective CPUs. We present ITHICA, an approach for automatically generating functional tests for defect-induced errors from arbitrary programs by inserting intra-thread, instruction-level error checks, primarily leveraging instruction duplication and output comparison. Our key insight is that the most pernicious defects cause inconsistent errors: two executions of the same instruction within the same thread, given the same inputs, can produce different architectural outputs depending on the execution context in which they run. By exploiting this insight, ITHICA enables arbitrary programs to serve as tests and identifies affected instructions upon error detections. We use ITHICA to transform industrial hyperscaler test programs (our baseline), datacenter workloads, and common libraries into functional tests, and evaluate them on over 3,000 CPU servers. ITHICA error checks detect 39% more defective servers than native checks within the ITHICA tests derived from our baseline programs, and enable novel findings on defect behavior that challenge conclusions drawn by prior hyperscaler fleet studies.

cs.AR

Silent Data Corruption by 10x Test Escapes Threatens Reliable Computing

Too many defective compute chips are escaping existing manufacturing tests -- at least an order of magnitude more than industrial targets across all compute chip types in data centers. Silent data corruptions (SDCs) caused by test escapes, when left unaddressed, pose a major threat to reliable computing. We present a three-pronged approach outlining future directions for overcoming test escapes: (a) Quick diagnosis of defective chips directly from system-level incorrect behaviors. Such diagnosis is critical for gaining insights into why so many defective chips escape existing manufacturing testing. (b) In-field detection of defective chips. (c) New test experiments to understand the effectiveness of new techniques for detecting defective chips. These experiments must overcome the drawbacks and pitfalls of previous industrial test experiments and case studies.

cs.AR