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F. Huegging

Publications and source records attributed to F. Huegging.

7 recordsLinked to original sources
arXiv2025

Pixel column issue in the ATLAS Inner Tracker modules

Pixel modules are currently being built for the ATLAS ITk Pixel detector upgrade. During the preproduction phase, recurring chip malfunctioning was observed during electrical testing. It was possible to bypass this issue by disabling some pixel core columns in the ITkPix readout chip. Therefore the issue is called "core column issue" which is a direct disqualifier for a pixel module. A concerning number of cases has been observed in pixel modules with ITkPix v1.1 as well as v2 chips which significantly impacts the module yield. However, the behaviour is erratic and there is not any evidence hinting at the origin of this issue. These proceedings outline the investigations of the issue, highlighting the electrical behaviour during testing, present findings from the data collected via our production database and through visual inspection, and point towards possible causes of the issue.

physics.ins-det↗
arXiv2012

Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK

In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2 x 10**15 neq/cm2, while requiring bias voltages in the order of 100 V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.

physics.ins-det↗
arXiv2009

Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200um, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110um to 150um. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 gamma-ray sources, charge collection tests with Sr90 beta-source and an overview of preliminary results from the CERN beam test.

physics.ins-det↗
arXiv2008

Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam

A small set of final prototypes of the ATLAS Inner Detector silicon tracker (Pixel and SCT) were used to take data during the 2004 Combined Test Beam. Data were collected from runs with beams of different flavour (electrons, pions, muons and photons) with a momentum range of 2 to 180 GeV/c. Four independent methods were used to align the silicon modules. The corrections obtained were validated using the known momenta of the beam particles and were shown to yield consistent results among the different alignment approaches. From the residual distributions, it is concluded that the precision attained in the alignment of the silicon modules is of the order of 5 micrometers in their most precise coordinate.

physics.ins-det↗
arXiv2006

Concept, realization and characterization of serially powered pixel modules (Serial Powering)

We prove and demonstrate here for the example of the large scale pixel detector of ATLAS that Serial Powering of pixel modules is a viable alternative and that has been devised and implemented for ATLAS pixel modules using dedicated on-chip voltage regulators and modified flex hybrids circuits. The equivalent of a pixel ladder consisting of six serially powered pixel modules with about 0.3Mpixels has been built and the performance with respect to noise and threshold stability and operation failures has been studied. We believe that Serial Powering in general will be necessary for future large scale tracking detectors.

physics.ins-det↗
arXiv2006

System Tests of the ATLAS Pixel Detector

The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment at the LHC (Large Hadron Collider) will be a pixel detector, which is presently under construction. Once installed into the experimental area, access will be extremely limited. To ensure that the integrated detector assembly operates as expected, a fraction of the detector which includes the power supplies and monitoring system, the optical readout, and the pixel modules themselves, has been assembled and operated in a laboratory setting for what we refer to as system tests. Results from these tests are presented.

physics.ins-det↗