G. Goussetis | Searcharxiv

arXiv2020

Satellite Communications in the New Space Era: A Survey and Future Challenges

Satellite communications have recently entered a period of renewed interest motivated by technological advances and nurtured through private investment and ventures. The present survey aims at capturing the state of the art in SatComs, while highlighting the most promising open research topics. Firstly, the main innovation drivers are motivated, such as new constellation types, on-board processing capabilities, nonterrestrial networks and space-based data collection/processing. Secondly, the most promising applications are described i.e. 5G integration, space communications, Earth observation, aeronautical and maritime tracking and communication. Subsequently, an in-depth literature review is provided across five axes: i) system aspects, ii) air interface, iii) medium access, iv) networking, v) testbeds & prototyping. Finally, a number of future challenges and the respective open research topics are described.

eess.SP↗

arXiv2008

Open Ended Microwave Oven for Packaging

A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices. In principle, the open oven cavity can be fitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. Variable frequency microwave (VFM) heating and curing of an idealised polymer load is numerically simulated using a multi-physics approach. Electro-magnetic fields within a novel open ended microwave oven developed for use in micro-electronics manufacturing applications are solved using a de icated Yee scheme finite-difference time-domain (FDTD) solver. Temperature distribution, degree of cure and thermal stresses are analysed using an Unstructured Finite Volume method (UFVM) multi-physics package. The polymer load was meshed for thermophysical analysis, whilst the microwave cavity - encompassing the polymer load - was meshed for microwave irradiation. The two solution domains are linked using a cross-mapping routine. The principle of heating using the evanescent fringing fields within the open-end of the cavity is demonstrated. A closed loop feedback routine is established allowing the temperature within a lossy sample to be controlled. A distribution of the temperature within the lossy sample is obtained by using a thermal imaging camera.

cs.OH↗