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Gabriel R. Jaffe

Publications and source records attributed to Gabriel R. Jaffe.

6 recordsLinked to original sources

Self-referencing photothermal common-path interferometry to measure absorption of Si3N4 membranes for laser-light sails

Laser-light sails are a spacecraft concept wherein lightweight "sails" are propelled by high-intensity lasers. We investigated the near-infrared absorption of free-standing membranes of stoichiometric silicon nitride (Si$_3$N$_4$), a candidate sail material. To resolve the small but non-zero optical loss, we used photothermal common-path interferometry (PCI), for which we developed a self-referencing modality where a PCI measurement is performed twice: once on a bare membrane, and a second time with monolayer graphene deposited on the membrane. The graphene increases the absorption of the sample by orders of magnitude, such that it can be measured by ellipsometry, without significantly affecting the thermal properties. We measured the absorption coefficient of Si$_3$N$_4$ to be (1.5-3) $\times$ 10$^{-2}$ cm$^{-1}$ at 1064 nm, making it a suitable sail material for laser intensities as high as ~10 GW/m$^2$. By comparison, silicon-rich "low stress" SiN$_x$ (x~1), with a measured absorption coefficient of approximately 8 cm$^{-1}$, is unlikely to survive such high laser intensities. Our self-referencing technique enables testing of low-loss membranes of various materials for laser sails and other applications.

physics.optics

The Effect of Dust and Hotspots on the Thermal Stability of Laser Sails

Laser sails propelled by gigawatt-scale ground-based laser arrays have the potential to reach relativistic speeds, traversing the solar system in hours and reaching nearby stars in years. Here, we describe the danger interplanetary dust poses to the survival of a laser sail during its acceleration phase. We show through multi-physics simulations how localized heating from a single optically absorbing dust particle on the sail can initiate a thermal-runaway process that rapidly spreads and destroys the entire sail. We explore potential mitigation strategies, including increasing the in-plane thermal conductivity of the sail to reduce the peak temperature at hotspots and isolating the absorptive regions of the sail which can burn away individually.

physics.space-ph

Thermal runaway of silicon-based laser sails

Laser sail-based spacecraft -- where a powerful earth-based laser propels a lightweight outer-space vehicle -- have been recently proposed by the Breakthrough Starshot Initiative as a means of reaching relativistic speeds for interstellar spacetravel. The laser intensity at the sail required for this task is at least 1 GW$\cdot$m$^{-2}$ and, at such high intensities, thermal management of the sail becomes a significant challenge even when using materials with low absorption coefficients. Silicon has been proposed as one leading candidate material for the sail due to its low sub-bandgap absorption and high index of refraction, which allows for low-mass-density designs. However, here we show that the temperature-dependent bandgap of silicon combined with two-photon absorption processes can lead to thermal runaway for even the most optimistic viable assumptions of the material quality. From our calculations, we set bounds on the maximum laser intensities that can be used for a thermally stable, Si-based laser sail.

physics.optics

Long Phonon Mean Free Paths Observed in Cross-plane Thermal-Conductivity Measurements of Exfoliated Hexagonal Boron Nitride

Sub-micron-thick layers of hexagonal boron nitride (hBN) exhibit high in-plane thermal conductivity, useful optical properties, and serve as dielectric encapsulation layers with low electrostatic inhomogeneity for graphene devices. Despite the promising applications of hBN as a heat spreader, the thickness dependence of the cross-plane thermal conductivity is not known, and the cross-plane phonon mean free paths in hBN have not been measured. We measure the cross-plane thermal conductivity of hBN flakes exfoliated from bulk crystals. We find that the thermal conductivity is extremely sensitive to film thickness. We measure a forty-fold increase in the cross-plane thermal conductivity between 7 nm and 585 nm flakes at 295 K. We attribute the large increase in thermal conductivity with increasing thickness to contributions from phonons with long mean free paths (MFPs), spanning many hundreds of nanometers in the thickest flakes. When planar twist interfaces are introduced into the crystal by mechanically stacking multiple thin flakes, the cross-plane thermal conductivity of the stack is found to be a factor of seven below that of individual flakes with similar total thickness, thus providing strong evidence that phonon scattering at twist boundaries limits the maximum phonon MFPs. These results have important implications for hBN integration in nanoelectronics and improve our understanding of thermal transport in two-dimensional materials.

cond-mat.mtrl-sci

A Simple Numerical Method for Evaluating Heat Dissipation from Curved Wires with Periodic Applied Heating

In many situations, the dual-purpose heater/thermometer wires used in the three-omega method, one of the most precise and sensitive techniques for measuring the thermal conductivity of thin films and interfaces, must include bends and curves to avoid obstructions on the surface of a sample. Although the three-omega analysis assumes that the heating wire is infinitely long and straight, recent experimental work has demonstrated that in some cases curved-wire geometries can be used without introducing detectable systematic error. We describe a general numerical method that can be used to calculate the temperature of three-omega heating wires with arbitrary wire geometries. This method provides experimentalists with a simple quantitative procedure for calculating how large the systematic error caused by a particular wire asymmetry will be. We show calculations of two useful cases: a straight wire with a single bend of arbitrary angle and a wire that forms a circle. We find that the amplitude of the in-phase temperature oscillations near a wire that forms a circle differs from the prediction using the analytic straight-line source solution by $<$12%, provided that the thermal penetration depth is less than ten times the radius of curvature of the wire path. The in-phase temperature amplitude 1.5 wire widths away from a 90$^{\circ}$ bend in a wire is within 11% of the straight-line source prediction for all penetration depths greater than the wire width. Our calculations indicate that the straight-line source solution breaks down significantly when the wire bend angle is less than 45$^{\circ}$.

cond-mat.mtrl-sci

Three-Omega Thermal-Conductivity Measurements with Curved Heater Geometries

The three-omega method, a powerful technique to measure the thermal conductivity of nanometer-thick films and the interfaces between them, has historically employed straight conductive wires to act as both heaters and thermometers. When investigating stochastically prepared samples such as two-dimensional materials and nanomembranes, residue and excess material can make it difficult to fit the required millimeter-long straight wire on the sample surface. There are currently no available criteria for how diverting three-omega heater wires around obstacles affects the validity of the thermal measurement. In this Letter, we quantify the effect of wire curvature by performing three-omega experiments with a wide range of frequencies using both curved and straight heater geometries on SiO$_2$/Si samples. When the heating wire is curved, we find that the measured Si substrate thermal conductivity changes by only 0.2%. Similarly, we find that wire curvature has no significant effect on the determination of the thermal resistance of a $\sim$65 nm SiO$_2$ layer, even for the sharpest corners considered here, for which the largest measured ratio of the thermal penetration depth of the applied thermal wave to radius of curvature of the heating wire is 4.3. This result provides useful design criteria for three-omega experiments by setting a lower bound for the maximum ratio of thermal penetration depth to wire radius of curvature.

cond-mat.mtrl-sci