arXiv subjects

Geert Hellings

Publications and source records attributed to Geert Hellings.

3 recordsLinked to original sources

arXiv2026

Are gate-all-around 2D CFETs the optimal architecture for the A2 node and beyond?

As logic scaling enters the angstrom era, vertically stacked complementary field-effect transistors (CFETs) based on atomically thin two-dimensional (2D) semiconductors offer a potential route to extend device scaling beyond the A2 node. Here, we develop an A2-oriented 2D CFET integration flow with a CPP of 36 nm and Lg of 10 nm and present initial demonstrations of several key process modules. Despite their atomically thin channels, 2D GAA CFETs do not provide a contacted poly pitch scaling advantage over Si GAA CFETs at the A2 node, because contact formation constraints impose a similar minimum CPP of 36 nm. We also combine a critical assessment with a multiscale power-performance-area (PPA) evaluation framework spanning quantum transport simulations, compact-model generation, A2-targeted 2D CFET gate-all-around (GAA) integration-flow definition, parasitic extraction and circuit-level benchmarking. Our analysis, however, shows that the expected benefits of 2D GAA CFETs are strongly constrained by non-idealities, in particular high contact resistance and dominant layout-induced parasitic capacitances. Although architectural optimization can improve the Ieff/Ceff ratio, the associated rise in absolute capacitance limits circuit-level gains. Meaningful progress will require co-optimization of contacts, transport and parasitics, together with 2D-specific CFET architectures.

physics.app-ph↗

arXiv2025

SOT-MRAM Bitcell Scaling with BEOL Read Selectors: A DTCO Study

This work explores the cross-node scaling potential of SOT-MRAM for last-level caches (LLCs) under heterogeneous system scaling paradigm. We perform extensive Design-Technology Co-Optimization (DTCO) exercises to evaluate the bitcell footprint for different cell configurations at a representative 7 nm technology and to assess their implications on read and write power-performance. We crucially identify the MTJ routing struggle in conventional two-transistor one-resistor (2T1R) SOT-MRAMs as the primary bitcell area scaling challenge and propose to use BEOL read selectors (BEOL RSs) that enable (10 -- 40) % bitcell area reduction and eventually match sub-N3 SRAM. On writability, we affirm that BEOL RS-based bitcells could meet the required SOT switching current, provided the magnetic free layer properties be engineered in line with LLC-specific, (0.1 -- 100) s retention targets. This is particularly to attribute to their (i) more available Si fins for write transistor and (ii) lower bitline resistance at reduced cell width. We nevertheless underscore the read tradeoff associated with BEOL RSs, with the low-drive IGZO-FET selector sacrificing the latency up to (3 -- 5) ns and the imperfectly rectifying diode selectors suffering (2.5 -- 5)$\times$ energy cost relative to 2T1R. This article thus highlights the realistic prospects and hurdles of BEOL RSs towards holistic power-performance-area scaling of SOT-MRAM.

cs.ET↗

arXiv2022

Physics-Based and Closed-Form Model for Cryo-CMOS Subthreshold Swing

Cryogenic semiconductor device models are essential in designing control systems for quantum devices and in benchmarking the benefits of cryogenic cooling for high-performance computing. In particular, the saturation of subthreshold swing due to band tails is an important phenomenon to include in low-temperature analytical MOSFET models as it predicts theoretical lower bounds on the leakage power and supply voltage in tailored cryogenic CMOS technologies with tuned threshold voltages. Previous physics-based modeling required to evaluate functions with no closed-form solutions, defeating the purpose of fast and efficient model evaluation. Thus far, only the empirically proposed expressions are in closed form. This article bridges this gap by deriving a physics-based and closed-form model for the full saturating trend of the subthreshold swing from room down to low temperature. The proposed model is compared against experimental data taken on some long and short devices from a commercial 28-nm bulk CMOS technology down to 4.2 K.

cond-mat.mes-hall↗