arXiv subjects

Gian Matteo Cossu

Publications and source records attributed to Gian Matteo Cossu.

5 recordsLinked to original sources

arXiv2023

Intrinsic timing properties of ideal 3D-trench silicon sensor with fast front-end electronics

This paper describes the fundamental timing properties of a single-pixel sensor for charged particle detection based on the 3D-trench silicon structure. We derive the results both analytically and numerically by considering a simple ideal sensor and the corresponding fast front-end electronics in two different case scenarios: ideal integrator and real fast electronics (trans-impedance amplifier). The particular shape of the Time of Arrival (TOA) distribution is examined and the relation between the time resolution and the spread of intrinsic charge collection time is discussed, by varying electronics parameters and discrimination thresholds. The results are obtained with and without simulated electronics noise. We show that the 3D-trench sensors are characterized by a $synchronous~region$, i.e. a portion of the active volume which leads to the same TOA values when charged particles cross it. The synchronous region size is dependent on the front-end electronics and discrimination threshold, and the phenomenon represents an intrinsic physical effect that leads to the excellent time resolution of these sensors. Moreover, we show that the TOA distribution is characterized by an intrinsic asymmetry, due to the 3D geometry only, that becomes negligible in case of significant electronics jitter.

physics.ins-det↗

arXiv2023

Timing performances of front-end electronics with 3D-trench silicon sensors

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of track densities in the foreseen experimental conditions. A promising solution to gain high-resolution performance at the sensor level is given by so-called 3D silicon sensors. The excellent intrinsic time resolution of a special case of 3D sensors, the trench type, is limited by residual non-uniformities in the duration of the induced currents. The intrinsic contribution of the sensor to the total time resolution of the system, when the detector is coupled to a front-end electronics, depends on the characteristics of the electronics itself and can be minimized with a proper design. This paper aims to analyze the possible performance in the timing of a typically-used front-end circuit, the Trans-Impedance Amplifier, considering different possible configurations. Evidence of the preferred modes of operation in sensor read-out for timing measurement will be given.

physics.ins-det↗

arXiv2023

Front-end Electronics for Timing with pico-seconds precision using 3D Trench Silicon Sensors

The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of $μ\text{m}$), radiation hardness ($10^{17}~1~$MeV n$_{eq}/$cm$^2$) and timing resolution (tens of ps). 3D silicon sensors, recently developed within the TimeSPOT initiative, offer a viable solution to cope with such demanding requirements. In order to accurately characterize the timing performance of these new sensors, several read-out boards, based on discrete active components, have been designed, assembled, and tested. The same electronics is also suitable for characterization of similar pixel sensors whenever timing performance in the order and below 10 ps is a requirement. This paper describes the general characteristics needed by front-end electronics to exploit solid-state sensors with fast timing capabilities and in particular, showcases the performance of the developed electronics in the testing and characterization of fast 3D silicon sensors.

physics.ins-det↗

arXiv2021

Accurate modelling of 3D-trench silicon sensor with enhanced timing performance and comparison with test beam measurements

This paper presents the detailed simulation of a double-pixel structure for charged particle detection based on the 3D-trench silicon sensor developed for the TIMESPOT project and a comparison of the simulation results with measurements performed at $π-$M1 beam at PSI laboratory. The simulation is based on the combined use of several software tools (TCAD, GEANT4, TCoDe and TFBoost) which allow to fully design and simulate the device physics response in very short computational time, O(1-100 s) per simulated signal, by exploiting parallel computation using single or multi-thread processors. This allowed to produce large samples of simulated signals, perform detailed studies of the sensor characteristics and make precise comparisons with experimental results.

physics.ins-det↗

arXiv2020

High-resolution timing electronics for fast pixel sensors

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders requires the use of time information in tracking, due to the increasing levels of track densities in the foreseen experimental conditions. Various different developments are ongoing on solid state sensors to gain high-resolution performance at the sensor level, as for example LGAD sensors or 3D sensors. Intrinsic sensor time resolution around 20 ps have been recently obtained. The increasing performance on the sensor side strongly demands an adequate development on the front-end electronics side, which now risks to become the performance bottle-neck in a tracking or vertex-detecting system. This paper aims to analyse the ultimate possible performance in timing of a typically-used front-end circuit, the Trans-Impedance Amplifier, considering different possible circuit configurations. Evidence to the preferable modes of operation in sensor read-out for timing measurement will be given.

physics.ins-det↗