Giovanni Serafino | Searcharxiv

arXiv2023

A Feasibility Study on Opportunistic Rainfall Measurement From Satellite TV Broadcasts

Rainfall precipitation maps are usually derived based on the measurements collected by classical weather devices, such as rain gauges and weather stations. This article aims to show the benefits obtained by opportunistic rainfall measurements based on signal strength measurements provided by commercial-grade satellite terminals (e.g., used in TV broadcasting). To assess not only the feasibility of this approach, with significant advantages in terms of capital and operational expenditure, but also improvements in terms of accuracy, we focus on a case study for agricultural applications using a Gaussian-modeled synthetic rain over a specific, real-world test area.

eess.SP↗

arXiv2020

Thermal vulnerability detection in integrated electronic and photonic circuits using IR thermography

Failure prediction of any electrical/optical component is crucial for estimating its operating life. Using high temperature operating life (HTOL) tests, it is possible to model the failure mechanisms for integrated circuits. Conventional HTOL standards are not suitable for operating life prediction of photonic components owing to their functional dependence on thermo-optic effect. This work presents an IR-assisted thermal vulnerability detection technique suitable for photonic as well as electronic components. By accurately mapping the thermal profile of an integrated circuit under a stress condition, it is possible to precisely locate the heat center for predicting the long-term operational failures within the device under test. For the first time, the reliability testing is extended to a fully functional microwave photonic system using conventional IR thermography. By applying image fusion using affine transformation on multimodal acquisition, it was demonstrated that by comparing the IR profile and GDSII layout, it is possible to accurately locate the heat centers along with spatial information on the type of component. Multiple IR profiles of optical as well as electrical components/circuits were acquired and mapped onto the layout files. In order to ascertain the degree of effectiveness of the proposed technique, IR profiles of CMOS RF and digital circuits were also analyzed. The presented technique offers a reliable automated identification of heat spots within a circuit/system.

physics.app-ph↗