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Hiroyuki Fujiki

Publications and source records attributed to Hiroyuki Fujiki.

2 recordsLinked to original sources

Reverse heat flow with Peltier-induced thermoinductive effect

The concept of "thermal inductance" expands the options of thermal circuit design. However, the inductive component is the only missing components in thermal circuits, unlike their electromagnetic counterparts. Herein, we report an electrically controllable reverse heat flow, in which heat flows from a low-temperature side to a high-temperature side locally and temporarily in a single material by imposing thermal inertia and an ac current. This effect can be regarded as an equivalent of the "thermoinductive" effect induced by the Peltier effect. We derive an exact solution indicating that this reverse heat flow occurs universally in solid-state systems and that it is considerably enhanced by thermoelectric properties. A local cooling of 25 mK is demonstrated in (Bi,Sb)2Te3, which is explained by our exact solution. This effect can be directly applied to the potential fabrication of a "thermoinductor" in thermal circuits.

physics.app-ph

Large-scalable fabrication of improved Bi-Te-based flexible thermoelectric modules using a semiconductor manufacturing process

Among the several flexible thermoelectric modules in existence, sintered Bi-Te-based modules represent a viable option because of their high output power density and flexibility, which enables the use of arbitrary heat sources. We have fabricated Bi-Te-based modules with a large-scalable fabrication process and improved their output performance. The reduction in the interconnection resistance, using thick electrodes of the flexible printed circuit, significantly improves the module's output power to 87 mW/cm$^{2}$ at $ΔT$ = 70 K, which is 1.3-fold higher than a previous prototype module. Furthermore, the establishment of the fabrication for the top electrodes by using the surface mount technology makes it possible to realize a high-throughput manufacturing of the module. Our durability tests reveal that there is no significant change in the internal resistance of the module during 10000 cycles of mechanical bending test and 1000 cycles of thermal stress test.

physics.app-ph