arXiv subjects

Hongkun Li

Publications and source records attributed to Hongkun Li.

2 recordsLinked to original sources

arXiv2018

Anisotropic model with truncated linear dispersion for lattice and interfacial thermal transport in layered materials

Recently, an anisotropic Debye model [Dames et al., Physical Review B 87, 12 (2013)] was proposed for calculations of the interfacial thermal conductance and the minimum thermal conductivity of graphite-like layered materials. Despite successes of the model in explaining heat transport mechanisms in layered materials (e.g., phonon focusing in highly anisotropic materials), the anisotropic Debye model assumes a phonon dispersion with unrealistic speeds of sounds especially for the flexural (ZA) phonons and overestimated cutoffs for all phonon branches. The deficiencies lead to substantially underestimated phonon irradiation for low-frequency phonons. Here, we develop an anisotropic model with truncated linear dispersion that resembles the real phonon dispersion, using speeds of sounds derived from elastic constants and cutoff frequencies derived from Brillouin zone boundaries. We also employ a piecewise linear function for the ZA phonons. Our model correctly calculates the phonon irradiation over a wide temperature range, verifying the accuracy of our model.We compare calculations of our and the Dames models to measurements of thermal conductivity of graphite and thermal conductance of metal/graphite interfaces, and find that the two models differ significantly for heat transport across the basal planes in graphite even at high temperatures. Our work thus provides a convenient analytical tool to study the phonon transport properties in layered materials.

physics.app-ph↗

arXiv2018

Achieving huge thermal conductance of metallic nitride on graphene through enhanced elastic and inelastic phonon transmission

Low thermal conductance of metal contacts is one of the main challenges in thermal management of nanoscale devices of graphene and other 2D materials. Previous attempts to search for metal contacts with high thermal conductance yielded limited success due to incomplete understanding of the origins of the low thermal conductance. In this paper, we carefully study the intrinsic thermal conductance across metal/graphene/metal interfaces to identify the heat transport mechanisms across graphene interfaces. We find that unlike metal contacts on diamond, the intrinsic thermal conductance of most graphene interfaces (except Ti and TiNx) is only about 50 % of the phonon radiation limit, suggesting that heat is carried across graphene interfaces mainly through elastic transmission of phonons. We thus propose a convenient approach to substantially enhance the phononic heat transport across metal contacts on graphene, by better matching the energy of phonons in metals and graphene, e.g., using metallic nitrides. We test the idea with TiNx, with phonon frequencies of up to 1.18*10^14 rad/s, 47 % of the highest phonon frequencies in graphene of 2.51*10^14 rad/s . Interestingly, we obtain a huge thermal conductance of 270 MW m-2 K-1 for TiNx/graphene interfaces, which is about 140 % of the phonon radiation limit. The huge thermal conductance could be partially attributed to inelastic phonon transport across the TiNx/graphene interface. Our work provides guidance for the search for good metal contacts on 2D materials and devices.

physics.app-ph↗