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Huiji Hu

Publications and source records attributed to Huiji Hu.

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Realization of polytype heterostructures via delicate structural transitions from a doped-Mott insulator

Transition metal dichalcogenides (TMDs) host multiple competing structural and electronic phases, making them an ideal platform for constructing polytype heterostructures with emergent quantum properties. However, controlling phase transitions to form diverse heterostructures inside a single crystal remains challenging. Here, we realize vertical/lateral polytype heterostructures in a hole-doped Mott insulator via thermal-annealing-induced structural transitions. Raman spectroscopy, atomic force microscopy (AFM) and scanning Kelvin probe force microscopy (SKPM) confirm the coexistence of T-H polytype heterostructures. Atomic-scale scanning tunneling microscopy/spectroscopy (STM/STS) measurements reveal the transparent effect in 1H/1T vertical heterostructures, where the charge density wave (CDW) of the underlying 1T-layer superposes on the top 1H-layer under positive bias. By systematically comparing 1T/1H and 1T/1T interfaces, we demonstrate that the metallic 1H-layer imposes a Coulomb screening effect on the 1T-layer, suppressing the formation of CDW domain walls and forming more ordered electronic states. These results clarify the interfacial coupling between distinct quantum many-body phases and establish a controllable pathway for constructing two-dimensional polytype heterostructures with tunable electronic properties.

cond-mat.mtrl-sci

Unveiling the delicate "hidden" interface conditions in WS2 flakes by advanced atomic force microscopy

The delicate interfacial conditions and behaviors play critical roles in determining the valuable physical properties of two-dimensional materials and their heterostructures on substrates. However, directly probing these complex interface conditions remains challenging. Here, we reveal the coupled in-plane strain and out-of-plane bonding conditions in strain-engineered WS2 flakes by combining dual-harmonic electrostatic force microscopy (DH-EFM) and scanning microwave impedance microscopy (sMIM). A striking contradiction is observed between the compressive-strain-induced larger bandgap (lower electrical conductivity) detected by DH-EFM, and the enhanced conductivity probed by sMIM. Comparative measurements under different sMIM modes demonstrate that this contradiction originates from a tip-loading-force-induced dynamic puckering effect, which is governed by the interfacial bonding strength. Furthermore, the progressive accumulation and subsequent release of conductivity during forward/backward sMIM-contact scans further confirms this dynamic puckering behavior, revealing pronounced differences in interface conditions between the open- and closed-ring regions of WS2. This work resolves the correlation between electrical properties and interface conditions, and provides fundamental insights for interface-engineered devices.

cond-mat.mtrl-sci