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Hyeon-Jin Shin

Publications and source records attributed to Hyeon-Jin Shin.

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Advances in Josephson Junction Materials and Processes Toward Practical Quantum Computing

The Josephson junction is the fundamental nonlinear building block of superconducting quantum technologies. Its macroscopic quantum tunneling physics underpins superconducting quantum computing, sensing, and communication, but scaling these platforms to utility-scale architectures places increasingly stringent demands on junction materials, interfaces, and fabrication. In quantum computing, these demands include high reproducibility, low dissipation, tunability, compact device footprint, and resilience to noise and defects. This review surveys how advances in materials science, device characterization, and nanofabrication are addressing these challenges and redefining the figures of merit for next-generation Josephson junctions. We also examine the evolution of fabrication strategies, from conventional multi-angle evaporation to foundry-compatible superconducting processes and the integration of emerging junction materials. Progress along these directions will determine how rapidly Josephson junctions move from laboratory-scale components to the foundation of industrial-scale quantum processors.

quant-ph

Amorphous Boron Nitride as an Ultrathin Copper Diffusion Barrier for Advanced Interconnects

This study focuses on amorphous boron nitride ($\rm α$-BN) as a novel diffusion barrier for advanced semiconductor technology, particularly addressing the critical challenge of copper diffusion in back-end-of-line (BEOL) interconnects. Owing to its ultralow dielectric constant and robust barrier properties, $\rm α$-BN is examined as an alternative to conventional low-k dielectrics. The investigation primarily employs theoretical modelling, using a Gaussian Approximation Potential, to simulate and understand the atomic-level interactions. This machine learning-based approach allows the performance of realistic simulations of amorphous structure of $\rm α$-BN, enabling the exploration of the impact of different film morphologies on barrier efficacy. Furthermore, we studied the electronic and optical properties of the films using a simple Tight-Binding model. In addition to the theoretical studies, we performed diffusion studies of copper through PECVD $\rm α$-BN on Si. The results from both the theoretical and experimental investigations highlight the potential of $\rm α$-BN as a highly effective diffusion barrier, suitable for integration in nanoelectronics. This research shows that $\rm α$-BN is a promising candidate for BEOL interconnects but also demonstrates the synergy of advanced computational models and experimental methods in material innovation for semiconductor applications.

cond-mat.mtrl-sci

Exploring Dielectric Properties in Models of Amorphous Boron Nitride

We report a theoretical study of dielectric properties of models of amorphous Boron Nitride, using interatomic potentials generated by machine learning. We first perform first-principles simulations on small (about $100$ atoms in the periodic cell) sample sizes to explore the emergence of mid-gap states and its correlation with structural features. Next, by using a simplified tight-binding electronic model, we analyse the dielectric functions for complex three dimensional models (containing about $10.000$ atoms) embedding varying concentrations of ${\rm sp^{1}, sp^{2}}$ and ${\rm sp^3}$ bonds between B and N atoms. Within the limits of these methodologies, the resulting value of the zero-frequency dielectric constant is shown to be influenced by the population density of such mid-gap states and their localization characteristics. We observe nontrivial correlations between the structure-induced electronic fluctuations and the resulting dielectric constant values. Our findings are however just a first step in the quest of accessing fully accurate dielectric properties of as-grown amorphous BN of relevance for interconnect technologies and beyond.

cond-mat.mtrl-sci

Designed Three-Dimensional Freestanding Single-Crystal Carbon Architectures

Single-crystal carbon nanomaterials have led to great advances in nanotechnology. The first single-crystal carbon nanomaterial, fullerene, was fabricated in a zero-dimensional form. One-dimensional carbon nanotubes and two-dimensional graphene have since followed and continue to provide further impetus to this field. In this study, we fabricated designed three-dimensional (3D) single-crystal carbon architectures by using silicon carbide templates. For this method, a designed 3D SiC structure was transformed into a 3D freestanding single-crystal carbon structure that retained the original SiC structure by performing a simple single-step thermal process. The SiC structure inside the 3D carbon structure is self-etched, which results in a 3D freestanding carbon structure. The 3D carbon structure is a single crystal with the same hexagonal close-packed structure as graphene. The size of the carbon structures can be controlled from the nanoscale to the microscale, and arrays of these structures can be scaled up to the wafer scale. The 3D freestanding carbon structures were found to be mechanically stable even after repeated loading. The relationship between the reversible mechanical deformation of a carbon structure and its electrical conductance was also investigated. Our method of fabricating designed 3D freestanding single-crystal graphene architectures opens up prospects in the field of single-crystal carbon nanomaterials, and paves the way for the development of 3D single-crystal carbon devices.

cond-mat.mes-hall