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Il-Kwon Oh

Publications and source records attributed to Il-Kwon Oh.

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Scale-robust Low Resistance Transport in Atomic Layer Deposited Topological Semimetal Wafers on Amorphous Substrate

As data-centric computing advances, energy-efficient interconnects are increasingly critical for AI-driven systems. Traditional metal conductors face severe limitations at nanoscale due to increased resistivity from surface scattering. In response, this study demonstrates the first wafer-scale realization of an amorphous topological semimetal, tantalum phosphide (TaP), grown directly on amorphous SiO2 substrates (without any seed layers) using low-temperature atomic layer deposition (ALD). The resulting TaP films exhibit unconventional resistivity scaling: decreasing resistivity with decreasing thickness, reaching 227 micro-ohm cm at ~2.3 nm film thickness. This behavior, observed without crystalline order or seed layers, indicates dominant surface conduction and establishes ALD-TaP as a promising candidate for back-end-of-line integration. The films also show excellent conformality, stoichiometry control, and thermal stability up to 600 degree C. A two-channel conduction model confirms surface-dominated transport in ultrathin regimes, further supported by enhanced conductivity in multi-stacked configurations. These findings highlight the potential of amorphous topological semimetals for future high-density, low-power electronic interconnects and expand the applicability of ALD for integrating novel quantum materials at scale.

cond-mat.mtrl-sci

Enabling P-type Conduction in Bilayer WS2 with NbP Topological Semimetal Contacts

Two-dimensional (2D) semiconductors are promising for low-power complementary metal oxide semiconductor (CMOS) electronics, which require ultrathin n- and p-type transistor channels. Among 2D semiconductors, WS2 is expected to have good conduction for both electrons and holes, but p-type WS2 transistors have been difficult to realize due to the relatively deep valence band and the presence of mid-gap states with conventional metal contacts. Here, we report topological semimetal NbP as p-type electrical contacts to bilayer WS2 with up to 5.8 microamperes per micron hole current at room temperature; this is the highest to date for sub 2 nm thin WS2 and more than 50 times larger than with metals like Ni or Pd. The p-type conduction is enabled by the simultaneously high work function and low density of states of the NbP, which reduce Fermi level pinning. These contacts are sputter-deposited at room temperature, an approach compatible with CMOS fabrication, a step towards enabling ultrathin WS2 semiconductors in future nanoelectronics.

cond-mat.mtrl-sci

Surface conduction and reduced electrical resistivity in ultrathin noncrystalline NbP semimetal

The electrical resistivity of conventional metals, such as copper, is known to increase in thin films due to electron-surface scattering, limiting the performance of metals in nanoscale electronics. Here, we find an unusual reduction of resistivity with decreasing film thickness in niobium phosphide (NbP) semimetal deposited at relatively low temperatures of 400 \deg C. In films thinner than 5 nm, the room temperature resistivity (~34 microohm*cm for 1.5-nm-thick NbP) was up to six times lower than the bulk NbP resistivity, and lower than conventional metals at similar thickness (typically ~100 microohm*cm). Remarkably, the NbP films are not crystalline, but display local nanocrystalline, short-range order within an amorphous matrix. Our analysis suggests that the lower effective resistivity is due to conduction via surface channels, together with high surface carrier density and sufficiently good mobility as the film thickness is reduced. These results and the fundamental insights obtained here could enable ultrathin, low-resistivity wires for nanoelectronics, beyond the limitations of conventional metals.

cond-mat.mtrl-sci