Jörg Neuefeind | Searcharxiv

arXiv2020

The Structure of Molten FLiNaK

The structure of the molten salt (LiF)$_{0.465}$(NaF)$_{0.115}$(KF)$_{0.42}$ (FLiNaK), a potential coolant for molten salt nuclear reactors, has been studied by ab initio molecular dynamics simulations and neutron total scattering experiments. We find that the salt retains well-defined short-range structural correlations out to approximately 9 Angstroms at typical reactor operating temperatures. The experimentally determined pair distribution function can be described with quantitative accuracy by the molecular dynamics simulations. These results indicate that the essential ionic interactions are properly captured by the simulations, providing a launching point for future studies of FLiNaK and other molten salts for nuclear reactor applications.

cond-mat.mtrl-sci↗

arXiv2019

Thermal expansion coefficients of high thermal conducting BAs and BP materials

Recent reported very high thermal conductivities in the cubic boron arsenide (BAs) and boron phosphide (BP) crystals could potentially provide a revolutionary solution in the thermal management of high power density devices. To fully facilitate such application, compatible coefficient of thermal expansion (CTE) between the heat spreader and device substrate, in order to minimize the thermal stress, need to be considered. Here we report our experimental CTE studies of BAs and BP in the temperature range from 100K to 1150K, through a combination of X-ray single crystal diffraction and neutron powder diffraction. We demonstrated the room temperature CTE, 3.6 $\pm$ 0.15 $\times$ 10E-6 /K for BAs and 3.2 $\pm$ 0.2 $\times$ 10E-6 /K for BP, are more compatible with most of the semiconductors including Si and GaAs, in comparison with diamond, and thus could be better candidates for the future heat spreader materials in power electronic devices.

cond-mat.mtrl-sci↗