arXiv subjects

James Kirkman

Publications and source records attributed to James Kirkman.

4 recordsLinked to original sources

arXiv2026

A Superconducting Phase Transition Single-Electron Transistor

Quantum computers require fast and accurate methods for qubit state detection. Phase-transition sensors exploit the abrupt change between two physical states of a material to achieve enhanced sensitivity and have enabled advanced detectors for quantum technologies, such as superconducting nanowire single-photon detectors. However, this sensing principle has not yet been applied to semiconductor spin qubits. Here, we demonstrate a superconducting phase-transition radio-frequency single-electron transistor (PTSET), a charge sensor for semiconductor spin qubits whose response is enhanced by a superconducting-to-normal phase transition. The transition is engineered by linking the sensor current to a low-critical-current, high-kinetic-inductance inductor integrated into the radio-frequency matching network. We demonstrate improvements in sensitivity of one and two orders of magnitude over conventional rfSETs in the large- and small-signal regimes, respectively. Our results establish phase-transition sensing as a route towards ultrasensitive, integrated charge sensors for semiconductor quantum computing and point to broader applications, including cryogenic photon detection for radio astronomy.

quant-ph↗

arXiv2026

Fast On-Chip Thermometry with TiN Kinetic Inductance Resonators in 22 nm Process Technology

Understanding the temporal and spatial dependence of temperature is critical in high-performance cryogenic devices. Typical thermometry techniques struggle to simultaneously combine high bandwidth, sensitivity and on-chip integration, limiting their ability to measure fast intra-device thermal fluctuations. Here, we demonstrate a time-resolved thermometry platform based on TiN kinetic inductance resonators integrated in a 22 nm FDSOI chip. By tracking temperature-dependent shifts in the resonant frequency, we achieve sub-millikelvin temperature sensitivity down to temperatures of 100 mK. Time-resolved on-chip pulsed heating experiments as a function of distance reveal an onset delay, consistent with a quasi-ballistic heat propagation velocity of 3.9 ${\pm}$ 0.1 mm ${\mu}$s${}^{-1}$. We also show that elevated temperatures increase net thermal conductance, shortening thermal relaxation times across all spatial separations. This behaviour manifests in two distinct regimes: a substrate-limited regime at 100 mK, where cooling rates vary with heater distance, and a Kapitza boundary-limited regime at 400 mK, where thermal relaxation becomes more spatially uniform. These measurements demonstrate kinetic inductance thermometry's ability to rapidly probe non-equilibrium temperature dynamics in cryogenic devices such as quantum processors.

quant-ph↗

arXiv2026

Stream Decoding with Confidence Scores at Room and Cryogenic Temperatures

In fault-tolerant quantum computing, fast and accurate decoding is crucial. Snowflake is a decoder for the surface code that runs in a streaming fashion. In this paper, we implement Snowflake on commercial FPGAs and validate them at room and cryogenic temperatures. Our results demonstrate high decoding throughput for small code distances that, when extrapolated, remains within acceptable limits for larger distances. Further, we incorporate the calculation of certain decoder confidence scores with negligible overhead both in terms of latency and physical resource utilisation. We note that implementing a large-scale system would require either a large FPGA beyond today's technology or clusters of FPGAs connected via a high-speed bus. Thus, we discuss an alternative architecture that exploits the locality of Snowflake by processing 2D slices of the 3D decoding window and offloading segments of the 3D structure to a high-speed memory.

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arXiv2024

A Multi-Module Silicon-On-Insulator Chip Assembly Containing Quantum Dots and Cryogenic Radio-Frequency Readout Electronics

Quantum processing units will be modules of larger information processing systems containing also digital and analog electronics modules. Silicon-based quantum computing offers the enticing opportunity to manufacture all the modules using the same technology platform. Here, we present a cryogenic multi-module assembly for multiplexed readout of silicon quantum devices where all modules have been fabricated using the same fully-depleted silicon-on-insulator (FDSOI) CMOS process. The assembly is constituted by three chiplets: (i) a low-noise amplifier (LNA), (ii) a single-pole eight-throw switch (SP8T), and (iii) a silicon quantum dot (QD) array. We integrate the chiplets into modules and show respectively, (i) a peak gain over 35dB with a 3dB bandwidth from 709MHz to 827MHz and an average noise temperature of 6.2K (minimum 4.2K), (ii) an insertion loss smaller than 1.1dB and a noise temperature less than 1.1K over the 0-2GHz range, and (iii) single-electron box (SEB) charge sensors. Finally, we combine all modules into a single demonstration showing time-domain radio-frequency multiplexing of two SEBs paving the way to an all-silicon quantum computing system.

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