SearcharxivSearch

arXiv subjects

Jared Parker

Publications and source records attributed to Jared Parker.

2 recordsLinked to original sources

Shallow Trap States Control Electrical Performance of Amorphous Oxide Semiconductor Thin-Film Transistors

The performance of n-type amorphous oxide semiconductor thin-film transistors (TFTs) is largely controlled by the density of states (DoS) near the conduction band mobility edge. Here, the full subgap DoS of amorphous InGaZnO (a-IGZO) TFTs, used in display panels and dynamic random-access memory (DRAM) development, is measured by ultrabroadband photoconduction (UP-DoS) microscopy to within 0.1 eV of the mobility edge. The measured subgap DoS for 25 TFT processing conditions accurately predicts each transfer curve, showing how shallow defect states are electron traps that rigidly tune subthreshold swing, threshold voltage and drift mobility. For a set of TFTs, the subthreshold transfer characteristics can be independently simulated from the experimental shallow defect DoS, with no adjustable parameters. The full transfer curve is simulated by introducing a single parameter: the conduction band tail energy. Additionally, the simulation reveals that the shallow trap density controlling subthreshold behavior can be directly extracted from transfer curves. Finally, a systematic In-enrichment study, combined with DFT+U DoS simulations, enables identification of vacancy cation coordination environments for all experimentally observed subgap peaks. The dominant trap controlling conventional a-IGZO TFT performance is centered at ~0.32 eV below the conduction band mobility edge and is assigned to a Ga-Ga-In oxygen vacancy defect.

physics.app-ph

Defect density of states of tin oxide and copper oxide p-type thin-film transistors

The complete subgap defect density of states (DoS) is measured using the ultrabroadband (0.15 to 3.5 eV) photoconduction response from p-type thin-film transistors (TFTs) of tin oxide, SnO, and copper oxide, Cu$_2$O. The TFT photoconduction spectra clearly resolve all bandgaps that further show the presence of interfacial and oxidized minority phases. In tin oxide, the SnO majority phase has a small 0.68 eV bandgap enabling ambipolar or p-mode TFT operation. By contrast, in copper oxide TFTs, an oxidized minority phase with a 1.4 eV bandgap corresponding to CuO greatly reduces the channel hole mobility at the charge accumulation region. Three distinct subgap DoS peaks are resolved for the copper oxide TFT and are best ascribed to copper vacancies, oxygen-on-copper antisites, and oxygen interstitials. For tin oxide TFTs, five subgap DoS peaks are observed and are similarly linked to tin vacancies, oxygen vacancies, and oxygen interstitials. Unipolar p-type TFT is achieved in tin oxide only when the conduction band-edge defect density peak ascribed to oxygen interstitials is large enough to suppress any n-mode conduction. Near the valence band edge in both active channel materials, the metal vacancy peak densities determine the hole concentrations, which further simulate the observed TFT threshold voltages.

cond-mat.mtrl-sci