arXiv subjects

Jayjit Mukherjee

Publications and source records attributed to Jayjit Mukherjee.

4 recordsLinked to original sources

arXiv2026

Barrier-channel intermixing and 2-dimensional electron gas degradation in Al-rich Al(Ga)N/AlGaN high electron mobility transistor heterostructures

In this work, we report on recent results in understanding and addressing the issue of interface smearing in high-aluminium content AlGaN/AlGaN heterostructures. On the one hand, the growth of high-crystal quality AlGaN by metal-organic vapour phase epitaxy (MOVPE) requires the use of high temperatures, but on the other hand this may lead to alloy intermixing between barrier and channel layers, which smoothens out the polarization contrast and severely degrades or even completely destroys the 2-dimensional electron gas (2DEG). We show that X-Ray Diffraction (XRD) analysis can be used as a non-destructive way to assess the sharpness of the interface, and that improved growth schemes can be successfully used to achieve high-quality 2DEG, as confirmed by contactless resistivity measurements. In particular, sheet resistivities around 2,500 $\Omega/\Box$ were demonstrated for AlN/Al$_{0.75}$Ga$_{0.25}$N, consistent with the best-reported values in the literature.

cond-mat.mtrl-sci↗

arXiv2025

Interplay of carrier density and mobility in Al-Rich (Al,Ga)N-Channel HEMTs: Impact on high-power device performance potential

Despite considerable advancements, high electron mobility transistors (HEMTs) based on gallium nitride (GaN) channels remain largely limited to power applications below 650 V. For higher power demands, the ultra-wide bandgap semiconductor alloy aluminium gallium nitride, (Al,Ga)N, has emerged as a key contender for next-generation HEMTs. In this theoretical study, we show that Al-rich Al$_x$Ga$_{1-x}$N-channel HEMTs (with $x \geq 0.5$) outperform the GaN-channel counterparts at and above room temperature, across all Al compositions, $x$. This contrasts with recent theory reports which suggest that only Al$_x$Ga$_{1-x}$N HEMTs with high Al content ($x \geq 0.85$) offer comparable performance to GaN-channel devices. Unlike previous assumptions of a constant two-dimensional electron gas (2DEG) density across the entire composition range $x$, we show that the 2DEG density is highly sensitive to both the Al content and thickness of the individual layers in a HEMT structure. We demonstrate that the superior performance of Al-rich (Al,Ga)N-channel HEMTs is driven by a competing effect between 2DEG density and electron mobility. This work challenges the assumptions of prior studies, which can result in a significant under or overestimation of the potential of high Al content HEMTs. The insights gained from our work provide a comprehensive understanding of the trade-offs between device and material parameters, thus help to guide the design of future Al-rich ($x = 0.5-1.0$) Al$_x$Ga$_{1-x}$N-channel HEMTs for high-power applications.

cond-mat.mtrl-sci↗

arXiv2023

Performance analysis of InAlN/GaN HEMT and optimization for high frequency applications

An InAlN/GaN HEMT device was studied using extensive temperature dependent DC IV measurements and CV measurements. Barrier traps in the InAlN layer were characterized using transient analysis. Forward gate current was modelled using analytical equations. RF performance of the device was also studied and device parameters were extracted following small signal equivalent circuit model. Extensive simulations in Silvaco TCAD were also carried out by varying stem height, gate length and incorporating back barrier to optimize the suitability of this device in Ku-band by reducing the detrimental Short Channel Effects (SCEs). In this paper a novel structure i.e., a short length T gate with recess, on thin GaN buffer to achieve high cut-off frequency (f$_T$) and high maximum oscillating frequency (f$_{max}$) apt for Ku-band applications is also proposed.

physics.app-ph↗

arXiv2023

Investigation of RF performance of Ku-band GaN HEMT device and an in-depth analysis of short channel effects

In this paper, we have characterized an AlGaN/GaN High Electron Mobility Transistor (HEMT) with a short gate length (Lg $\approx$ 0.15$\mu$m). We have studied the effect of short gate length on the small signal parameters, linearity parameters and gm-gd ratio in GaN HEMT devices. To understand how scaling results in the variation of the above-mentioned parameters a comparative study with higher gate length devices on similar heterostructure is also presented here. We have scaled down the gate length but the barrier thickness(t$_{bar}$) remained same which affects the aspect ratio (L$_{g}$/t$_{bar}$) of the device and its inseparable consequences are the prominent short channel effects (SCEs) barring the optimum output performance of the device. These interesting phenomena were studied in detail and explored over a temperature range of -40$^\circ$C to 80$^\circ$C. To the best of our knowledge this paper explores temperature dependence of SCEs of GaN HEMT for the first time. With an approach to reduce the impact of SCEs a simulation study in Silvaco TCAD was carried out and it is observed that a recessed gate structure on conventional heterostructure successfully reduces SCEs and improves RF performance of the device. This work gives an overall view of gate length scaling on conventional AlGaN/GaN HEMTs.

physics.app-ph↗