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Jian-Wei Su

Publications and source records attributed to Jian-Wei Su.

2 recordsLinked to original sources

RCW-CIM: A Digital CIM-based LLM Accelerator with Read-Compute/Write

Digital computing-in-memory (DCIM) has emerged as a promising solution for large language model (LLM) acceleration by minimizing data transfers between external DRAM and on-chip accelerators while maintaining high precision for superior accuracy. However, existing CIM architectures often overlook weight update latency, which becomes critical as LLM weights are far larger than a single CIM macro capacity. To address this issue, this paper proposes a read-compute/write (RCW) architecture that effectively minimizes weight update latency, along with a nonlinear operator fusion that further mitigates dependencyinduced latency. The proposed RCW reduces decoding computing latency by 21.59% on the Llama2-7B model. In addition, the nonlinear operator fusion mechanism achieves a 69.17% latency reduction through efficient partial accumulation and group-based approximation. Furthermore, a weight-stationary and output column stationary (WS-OCS) dataflow is introduced to reduce both external DRAM access and internal CIM weight updates by 51.6% and 87.6% respectively during the prefill phase of 1024 tokens, leading to an overall 49.76% latency reduction. Fabricated using TSMC 22 nm CMOS technology and operating at 100 MHz, the proposed RCW-CIM achieves 3.28 TOPS and 42.3 TOPS/W, enabling 4.2 ms prefill latency and 26.87 decoded tokens per second for the INT4-weight Llama2 model with dual DDR5-6400 memory.

cs.AR

3DGauCIM: Accelerating Static/Dynamic 3D Gaussian Splatting via Digital CIM for High Frame Rate Real-Time Edge Rendering

Dynamic 3D Gaussian splatting (3DGS) extends static 3DGS to render dynamic scenes, enabling AR/VR applications with moving objects. However, implementing dynamic 3DGS on edge devices faces challenges: (1) Loading all Gaussian parameters from DRAM for frustum culling incurs high energy costs. (2) Increased parameters for dynamic scenes elevate sorting latency and energy consumption. (3) Limited on-chip buffer capacity with higher parameters reduces buffer reuse, causing frequent DRAM access. (4) Dynamic 3DGS operations are not readily compatible with digital compute-in-memory (DCIM). These challenges hinder real-time performance and power efficiency on edge devices, leading to reduced battery life or requiring bulky batteries. To tackle these challenges, we propose algorithm-hardware co-design techniques. At the algorithmic level, we introduce three optimizations: (1) DRAM-access reduction frustum culling to lower DRAM access overhead, (2) Adaptive tile grouping to enhance on-chip buffer reuse, and (3) Adaptive interval initialization Bucket-Bitonic sort to reduce sorting latency. At the hardware level, we present a DCIM-friendly computation flow that is evaluated using the measured data from a 16nm DCIM prototype chip. Our experimental results on Large-Scale Real-World Static/Dynamic Datasets demonstrate the ability to achieve high frame rate real-time rendering exceeding 200 frame per second (FPS) with minimal power consumption, merely 0.28 W for static Large-Scale Real-World scenes and 0.63 W for dynamic Large-Scale Real-World scenes. This work successfully addresses the significant challenges of implementing static/dynamic 3DGS technology on resource-constrained edge devices.

cs.AR