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Jiandong Ouyang

Publications and source records attributed to Jiandong Ouyang.

2 recordsLinked to original sources

Truncated hybrid tensor networks for distributed quantum simulation

Simulation of quantum many-body systems is a principal application of quantum computing, but available devices remain limited by the number of qubits and cannot accommodate systems of the desired size. One approach is to host a large evolution across several modest distributed systems that exchange classical information alone. Current protocols such as circuit knitting incur a quasi-probability sampling cost that grows exponentially with the number of remote gates across the cut, even when physical correlations across the cut are actually bounded. In this work, we present a truncated hybrid tensor network (THTN) framework in which a remote two-body gate is applied as a sum of local unitaries on the subsystems, linked by a classical connecting tensor, and an interface truncation retains Schmidt modes across the cut. Remote gates between the same subsystems can be merged on one connector, so non-one-dimensional models, such as layered partitions with strong intra-layer and weaker interlayer couplings, may be cast onto a one-dimensional cut. The retained non-negative Schmidt coefficients also define a sampling rule for local observables. We validate this distributed protocol by classical simulation against time-evolving block decimation (TEBD) at the same bond dimension. The truncated dynamics track the TEBD references on chains and ladders, with the clearest gain on a layered model.

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Low-Loss, High-Coherence Airbridge Interconnects Fabricated by Single-Step Lithography

Airbridges are essential for creating high-performance, low-parasitic interconnects in integrated circuits and quantum devices. Conventional multi-step fabrication methods hinder miniaturization and introduce process-related defects. We report a simplified process for fabricating nanoscale airbridges using only a single electron-beam lithography step. By optimizing a multilayer resist stack with a triple-exposure-dose scheme and a thermal reflow step, we achieve smooth, suspended metallic bridges with sub-200-nm features that exhibit robust mechanical stability. Fabricated within a gradiometric SQUID design for superconducting transmon qubits, these airbridges introduce no measurable additional loss in the relaxation time $T_1$, while enabling a 2.5-fold enhancement of the dephasing time $T_2^*$. This efficient method offers a practical route toward integrating high-performance three-dimensional interconnects in advanced quantum and nano-electronic devices.

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