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Jingru Jiang

Publications and source records attributed to Jingru Jiang.

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Unveiling the Scaling Potential of Drain Merge through Active (DMtA) in CFETs: Breaking the Super-Via Bottlenecks and Unlocking New PPA Boosters

Drain merge (DM), a super via vertically connecting the common S/D terminals of stacked n/pFETs in Complementary FETs (CFETs), blocks further parasitic optimization and cell scaling. For the first time, this work systematically investigates the state-of-the-art Drain Merge through Active (DMtA), a revolutionary technology reported recently with the DM embedded in the active region, through a comprehensive DTCO framework spanning process integration, contact-configuration-dependent (CTCD) compact modeling, standardcell design, RO evaluation and block-level PPA benchmark on a 32-bit RISC-V Ibex core. By reducing DM parasitics and enabling DM-width optimization, DMtA improves RO frequency by 11.7% over its conventional Drain Merge through field (DMtF) counterpart. Active widening and Area Borrowing, the latter first reported in [8] and exploiting spatial slack in adjacent cells to further enlarge the nanosheet width (WNS), increase the maximum Ibex-core frequency by up to 34.8%. More importantly, DMtA also enables the once GAA-exclusive Hyper-cells on CFETs by merging the active regions across adjacent cell rows, providing a further 8.7% frequency gain. A post-routing floating-output-pin-aware optimization further removes redundant S/D contacts (CTs) and reduces power by 5.3%. Finally, DMtA facilitates more area-efficient 2.5T cell scaling by preserving single-row cell compatibility, reducing post-PR core area by 25.7%.

cond-mat.mes-hall

Overlay-aware Variation Study of Flip FET and Benchmark with CFET

In this work, we carried out an overlay-aware variation study on Flip FET (FFET) considering the impact on RC parasitics induced by the lithography misalignment in backside processes, and benchmarked it with CFET in terms of the power-performance (PP) and variation sources. The iso-leakage frequency degrades up to 2.20% with layout misalignment of 4 nm. It's found that the Drain Merge resistance degrades significantly with misalignment increasing and is identified as the major variation source. Through careful DTCO with design rule optimization, the variation can be greatly suppressed, while the resistance fluctuation of the DM also drops substantially. Monte Carlo random experiments were also conducted, validating the variation reduction. Comparing with the CFET featuring self-aligned gate and much less overlay induced misalignment, fortunately, FFET's PP is still better except when misalignment reaches 8 nm, which is out of spec and nearly impossible. Considering the variabilities induced by the high aspect ratio processes, CFET still faces big challenges compared with FFET.

cond-mat.mes-hall