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Joel C. Weber

Publications and source records attributed to Joel C. Weber.

8 recordsLinked to original sources

Characterization of Silicon-Membrane TES Microcalorimeters for Large-Format X-ray Spectrometers with Integrated Microwave SQUID Readout

We present the electro-thermal characterization of transition-edge sensor (TES) detectors suspended on Si membranes fabricated using a silicon-on-insulator (SOI) wafer. The use of an all-silicon fabrication platform, in contrast to the more commonly used silicon nitride membranes, is compatible with monolithic fabrication of integrated TES and SQUID circuits. The all-silicon architecture additionally allows efficient use of focal plane area; the readout circuitry may be positioned out of the focal plane by bending a thinned portion of the chip. Compatibility with integrated fabrication and efficient use of focal plane area provide a path to an efficient soft X-ray spectrometer. This work is motivated by our goal to develop a 10,000-pixel TES spectrometer to overcome critical measurement limitations in catalysis research. The characterization of fragile, carbon-based intermediates via techniques like Resonant Inelastic X-ray Scattering (RIXS) is often precluded by the slow, high-flux nature of existing technologies. The new instrument will allow for fast RIXS measurements to be made without causing sample damage. We verify the detector models and measure the energy resolution using a pulsed optical laser, demonstrating the viability of this approach for the final instrument to be deployed at the National Synchrotron Light Source II (NSLS-II).

physics.ins-det↗

Lithographic integration of TES microcalorimeters with SQUID multiplexer circuits for large format spectrometers

Arrays of hundreds or thousands of low temperature detectors have been deployed for many experiments, both bolometers for long wavelength applications and calorimeters for shorter wavelength applications. One challenge that is common to many of these arrays is the efficient use of focal plane area to achieve a large fill fraction of absorbers coupled to detectors. We are developing an integrated fabrication of soft X-ray transition edge sensors (TES) and microwave SQUID multiplexers ($μ$MUX) with the goal of maximizing the fill fraction of the focal plane area on a scale of many thousand pixel detectors. We will utilize lithographically defined high density interconnects to circumvent limitations in existing solutions that use wirebonds or flip-chip bonds. Here we report the first demonstration of combining TES and $μ$MUX processes into a single TES-System-on-a-Chip (TES-SoC) fabrication on a silicon wafer. The $μ$MUX SQUIDs and TES electrothermal feedback circuits are microfabricated first and protected with passivating SiO$_2$, then the TES devices and TES-to-SQUID interconnects are fabricated, and finally the protective layer is removed before the fabrication of the microwave resonators. We show that the microwave SQUIDs are functional and have reasonable yield, and that we are able to read out the transition temperature of the connected TESs using those SQUIDs.

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A high-speed, high-resolution Transition Edge Sensor spectrometer for soft X-rays at the Advanced Photon Source

This project explores the design and development of a transition edge sensor (TES) spectrometer for resonant soft X- ray scattering (RSXS) measurements developed in collaboration between Argonne National Laboratory (ANL) and the National Institute of Standards and Technology (NIST). Soft X-ray scattering is a powerful technique for studying the electronic and magnetic properties of materials on a microscopic level. However, the lack of high-performance soft X-ray spectrometers has limited the potential of this technique. TES spectrometers have the potential to overcome these limitations due to their high energy resolution, high efficiency, and broad energy range. This project aims to optimize the design of a TES spectrometer for RSXS measurements and more generally soft X-ray spectroscopy at the Advanced Photon Source (APS) 29-ID, leading to improved understanding of advanced materials. We will present a detailed description of the instrument design and implementation. The spectrometer consists of a large array of approximately 250 high-speed and high-resolution pixels. The pixels have saturation energies of approximately 1 keV, sub-ms pulse duration and energy resolution of approximately 1 eV. The array is read out using microwave multiplexing chips with MHz bandwidth per channel, enabling efficient data throughput. To facilitate measurement of samples in situ under ultra-high vacuum conditions at the beamline, the spectrometer is integrated with an approximately 1 m long snout.

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Nanoscale Three-Dimensional Imaging of Integrated Circuits using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer

X-ray nanotomography is a powerful tool for the characterization of nanoscale materials and structures, but is difficult to implement due to competing requirements on X-ray flux and spot size. Due to this constraint, state-of-the-art nanotomography is predominantly performed at large synchrotron facilities. We present a laboratory-scale nanotomography instrument that achieves nanoscale spatial resolution while changing the limitations of conventional tomography tools. The instrument combines the electron beam of a scanning electron microscope (SEM) with the precise, broadband X-ray detection of a superconducting transition-edge sensor (TES) microcalorimeter. The electron beam generates a highly focused X-ray spot in a metal target held micrometers away from the sample of interest, while the TES spectrometer isolates target photons with high signal-to-noise. This combination of a focused X-ray spot, energy-resolved X-ray detection, and unique system geometry enable nanoscale, element-specific X-ray imaging in a compact footprint. The proof-of-concept for this approach to X-ray nanotomography is demonstrated by imaging 160 nm features in three dimensions in 6 layers of a Cu-SiO2 integrated circuit, and a path towards finer resolution and enhanced imaging capabilities is discussed.

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Semiconductor thermal and electrical properties decoupled by localized phonon resonances

Thermoelectric materials convert heat into electricity through thermally driven charge transport in solids, or vice versa for cooling. To be competitive with conventional energy-generation technologies, a thermoelectric material must possess the properties of both an electrical conductor and a thermal insulator. However, these properties are normally mutually exclusive because of the interconnection of the scattering mechanisms for charge carriers and phonons. Recent theoretical investigations on sub-device scales have revealed that silicon membranes covered by nanopillars exhibit a multitude of local phonon resonances, spanning the full spectrum, that couple with the heat-carrying phonons in the membrane and collectively cause a reduction in the in-plane thermal conductivity$-$while, in principle, not affecting the electrical properties because the nanopillars are external to the pathway of voltage generation and charge transport. Here this effect is demonstrated experimentally for the first time by investigating device-scale suspended silicon membranes with GaN nanopillars grown on the surface. The nanopillars cause up to 21 % reduction in the thermal conductivity while the electrical conductivity and the Seebeck coefficient remain unaffected, thus demonstrating an unprecedented decoupling in the semiconductor's thermoelectric properties. The measured thermal conductivity behavior for coalesced nanopillars and corresponding lattice-dynamics calculations provide further evidence that the reductions are mechanistically tied to the phonon resonances. This finding breaks a longstanding trade-off between competing properties in thermoelectricity and paves the way for engineered high-efficiency solid-state energy recovery and cooling.

cond-mat.mes-hall↗

A tabletop x-ray tomography instrument for nanometer-scale imaging: demonstration of the 1,000-element transition-edge sensor subarray

We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial resolution scanning electron microscope (SEM) with a highly efficient and pixelated TES spectrometer to reconstruct three-dimensional maps of nanoscale integrated circuits (ICs). A 240-pixel prototype spectrometer was recently used to reconstruct ICs at the 130 nm technology node, but to increase imaging speed to more practical levels, the detector efficiency needs to be improved. For this reason, we are building a spectrometer that will eventually contain 3,000 TES microcalorimeters read out with microwave superconducting quantum interference device (SQUID) multiplexing, and we currently have commissioned a 1,000 TES subarray. This still represents a significant improvement from the 240-pixel system and allows us to begin characterizing the full spectrometer performance. Of the 992 maximimum available readout channels, we have yielded 818 devices, representing the largest number of TES x-ray microcalorimeters simultaneously read out to date. These microcalorimeters have been optimized for pulse speed rather than purely energy resolution, and we measure a FWHM energy resolution of 14 eV at the 8.0 keV Cu K$α$ line.

physics.ins-det↗

Design of a 3000-pixel transition-edge sensor x-ray spectrometer for microcircuit tomography

Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabrication. This can be important for process development, defect analysis, and detection of unexpected structures in externally sourced chips, among other applications. Here, we report on a non-destructive, tabletop approach that addresses this imaging problem through x-ray tomography, which we uniquely realize with an instrument that combines a scanning electron microscope (SEM) with a transition-edge sensor (TES) x-ray spectrometer. Our approach uses the highly focused SEM electron beam to generate a small x-ray generation region in a carefully designed target layer that is placed over the sample being tested. With the high collection efficiency and resolving power of a TES spectrometer, we can isolate x-rays generated in the target from background and trace their paths through regions of interest in the sample layers, providing information about the various materials along the x-ray paths through their attenuation functions. We have recently demonstrated our approach using a 240 Mo/Cu bilayer TES prototype instrument on a simplified test sample containing features with sizes of $\sim$1 $μ$m. Currently, we are designing and building a 3000 Mo/Au bilayer TES spectrometer upgrade, which is expected to improve the imaging speed by factor of up to 60 through a combination of increased detector number and detector speed.

physics.ins-det↗

Absolute Energy Measurements with Superconducting Transition-Edge Sensors for Muonic X-ray Spectroscopy at 44 keV

Superconducting transition-edge sensor (TES) microcalorimeters have great utility in x-ray applications owing to their high energy resolution, good collecting efficiency and the feasibility of being multiplexed into large arrays. In this work, we develop hard x-ray TESs to measure the absolute energies of muonic-argon ($μ$-Ar) transition lines around 44 keV and 20 keV. TESs with sidecar absorbers of different heat capacities were fabricated and characterized for their energy resolution and calibration uncertainty. We achieved ~ 1 eV absolute energy measurement accuracy at 44 keV, and < 12 eV energy resolution at 17.5 keV.

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