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John P. Reidy

Publications and source records attributed to John P. Reidy.

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Two-step transient liquid phase bonding of NiTi to Ti-6Al-4V through a NbZrW barrier

Dissimilar joining of NiTi to Ti-6Al-4V (Ti-64) is limited by brittle Ti2Ni formation and degradation of NiTi functionality. A two-step transient liquid phase (TLP) route was developed in which a refractory NbZrW diffusion barrier converts the incompatible couple into two independently bondable interfaces. The barrier plays a different role for each alloy: a reactive substrate for NiTi, dissolving to form a Ti-rich Ni-Ti-Nb liquid that infiltrates its own grain boundaries and is terminated by selective Ti absorption into the barrier; and an inert substrate for Ti-64, joined through contact melting of a sacrificial Cu foil. Both interfaces are fully dense and free of continuous intermetallic layers. In tension, joints spanning both interfaces began transforming at 350 MPa, exhibited a stress plateau to 2.5 global strain (consistent with stress-induced transformation of the NiTi half of the gauge) and failed beyond the plateau at 380-410 MPa. Five load-unload cycles to 460 MPa showed stable superelastic loops with minor ratcheting. These results demonstrate that a diffusion barrier enables dissimilar TLP joining of otherwise incompatible alloys.

cond-mat.mtrl-sci

Transient Liquid Phase Bonding of NiTi Using Cu- and Nb-base Interlayers

Transient liquid phase (TLP) bonding was examined as an approach for joining NiTi to achieve a high joint efficiency while minimizing chemical variance within the joint region. Two bonding interlayer chemistries (Cu-base and Nb-base) were identified by screening thermodynamic criteria for TLP in ternary alloys using the CALPHAD method. These two systems were then experimentally evaluated with respect to their impact on solidification kinetics, microstructure in the joint region, and performance during quasistatic and cyclic tensile loading. For both interlayer chemistries, the composition profile and microstructure in the joint region confirmed an isothermal solidification mechanism. In addition, the joints were found to be fully dense and contain at most 1.2% intermetallic phases. Tensile testing showed excellent load transfer across the joints with approximately 4% recoverable strain and martensite onset stresses reaching 94% and 89% of the unbonded, annealed NiTi values for Cu-base and Nb-base interlayers, respectively. Lastly, a stable superelastic response was observed under cyclic loading for both bond chemistries, with spatial variation in the strain evolution linked to enhanced stiffness and hardness in the joint region arising from the substitutional Cu and Nb solutes, as confirmed via nanoindentation. This study demonstrates that TLP bonding of NiTi can produce high-strength and nearly intermetallic-free joints without sacrificing functional performance, such as the superelastic response.

cond-mat.mtrl-sci